Inventor · disambiguated record
Kwangok Jeong
Also filed as: JEONG KWANGOK
7 granted patents·11 pending applications·70 citations·filing 2005–2024
85Inventor score
Top patents by PatentIndex Score
18 records- 0197US9887210B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 6, 2018·27 cites·13 claims
- 0293US10050058B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 14, 2018·8 cites·20 claims
- 0382US11404443B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 2, 2022·1 cites·26 claims
- 0482US7453300B2MTCMOS flip-flop, circuit including the MTCMOS flip-flop, and method of forming the MTCMOS flip-flopSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 18, 2008·14 cites·32 claims
- 0581US10026661B2Semiconductor device for testing large number of devices and composing method and test method thereofWON HYOSIG·Filed 2015·Granted Jul 17, 2018·10 cites·19 claims
- 0681US10002223B2Method of designing layout of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 19, 2018·4 cites·20 claims
- 0779US9811626B2Method of designing layout of semiconductor deviceJEONG KWANGOK·Filed 2015·Granted Nov 7, 2017·6 cites·19 claims
- 0859US2025253218A1Semiconductor package and manufacturing method of semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0959US2018350838A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1059US2025062213A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1155US2025006606A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1255US2024429176A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1355US2024071899A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1452US2024055342A1Semiconductor packages and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1552US2024162127A1Semiconductor packages having dummy postsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1650US2023142267A1Semiconductor packages having upper conductive patternsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1736US2018226303A1Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 1835US2012111625A1Printed circuit board and method for filling via hole thereofJEONG KWANGOK·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →