Inventor · disambiguated record
Kwok Fai Lai
Also filed as: LAI KWOK F · LAI KWOK FAI
13 granted patents·2 pending applications·1,001 citations·filing 1993–2008
94Inventor score
Top patents by PatentIndex Score
15 records- 0198US5482611APhysical vapor deposition employing ion extraction from a plasmaFiled 1993·Granted Jan 9, 1996·308 cites·29 claims
- 0297US6179973B1Apparatus and method for controlling plasma uniformity across a substrateNOVELLUS SYSTEMS INC·Filed 1999·Granted Jan 30, 2001·167 cites·20 claims
- 0396US6193854B1Apparatus and method for controlling erosion profile in hollow cathode magnetron sputter sourceNOVELLUS SYSTEMS INC·Filed 1999·Granted Feb 27, 2001·145 cites·34 claims
- 0495US5593551AMagnetron sputtering source for low pressure operationVARIAN ASSOCIATES·Filed 1995·Granted Jan 14, 1997·141 cites·12 claims
- 0590US6342133B2PVD deposition of titanium and titanium nitride layers in the same chamber without use of a collimator or a shutterNOVELLUS SYSTEMS INC·Filed 2000·Granted Jan 29, 2002·92 cites·12 claims
- 0689US6497796B1Apparatus and method for controlling plasma uniformity across a substrateNOVELLUS SYSTEMS INC·Filed 2000·Granted Dec 24, 2002·34 cites·15 claims
- 0786US6444105B1Physical vapor deposition reactor including magnet to control flow of ionsNOVELLUS SYSTEMS INC·Filed 2000·Granted Sep 3, 2002·22 cites·23 claims
- 0884US6683425B1Null-field magnetron apparatus with essentially flat targetNOVELLUS SYSTEMS INC·Filed 2002·Granted Jan 27, 2004·22 cites·20 claims
- 0980US7585399B1Rotating magnet arrays for magnetron sputtering apparatusNOVELLUS SYSTEMS INC·Filed 2005·Granted Sep 8, 2009·5 cites·10 claims
- 1075US6541371B1Apparatus and method for depositing superior Ta(N)/copper thin films for barrier and seed applications in semiconductor processingNOVELLUS SYSTEMS INC·Filed 2000·Granted Apr 1, 2003·17 cites·36 claims
- 1173US7717749B2Multiport RJ connectorBEL FUSE INC·Filed 2003·Granted May 18, 2010·24 cites·4 claims
- 1273US6905959B1Apparatus and method for depositing superior Ta (N) copper thin films for barrier and seed applications in semiconductor processingNOVELLUS SYSTEMS INC·Filed 2002·Granted Jun 14, 2005·14 cites·5 claims
- 1350US2008264340A1Moving interleaved sputter chamber shieldsNOVELLUS SYSTEMS INC·Filed 2008·Application pending·0 cites
- 1431US6149050AMethod for attaching solderable wire leads to a lead frameBEL FUSE INC·Filed 1999·Granted Nov 21, 2000·10 cites·12 claims
- 1531US2003022553A1Multiport RJ connectorBEL FUSE INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →