Inventor · disambiguated record
Kwan Heum Lee
Also filed as: LEE KWAN H · LEE KWAN HEUM
37 granted patents·6 pending applications·139 citations·filing 2008–2022
96Inventor score
Top patents by PatentIndex Score
43 records- 0196US10297601B2Semiconductor devices with layers commonly contacting fins and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 21, 2019·19 cites·19 claims
- 0296US10079305B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 18, 2018·25 cites·16 claims
- 0395US9761719B2Semiconductor device having silicon-germanium source/drain regions with varying germanium concentrationsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 12, 2017·19 cites·20 claims
- 0494US11705503B2Semiconductor device including non-sacrificial gate spacers and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 18, 2023·3 cites·18 claims
- 0592US9397219B2Semiconductor devices having source/drain regions with strain-inducing layers and methods of manufacturing such semiconductor devicesKIM SEOK-HOON·Filed 2015·Granted Jul 19, 2016·8 cites·20 claims
- 0691US10304932B2Semiconductor device having a fin structure and a manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 28, 2019·8 cites·19 claims
- 0791US9502532B2Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 22, 2016·9 cites·20 claims
- 0889US9881838B2Semiconductor devices having multiple gate structures and methods of manufacturing such devicesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 30, 2018·5 cites·12 claims
- 0986US9972716B2Semiconductor devicesKIM JIN BUM·Filed 2015·Granted May 15, 2018·5 cites·18 claims
- 1086US9368495B2Semiconductor devices having bridge layer and methods of manufacturing the sameKIM SEOK-HOON·Filed 2014·Granted Jun 14, 2016·6 cites·17 claims
- 1182US9590103B2Semiconductor devices having multiple gate structures and methods of manufacturing such devicesKIM YOON HAE·Filed 2016·Granted Mar 7, 2017·4 cites·20 claims
- 1282US9275995B2Semiconductor devices having composite spacers containing different dielectric materialsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 1, 2016·6 cites·15 claims
- 1381US10008600B2Semiconductor device having silicon-germanium source/drain regions with varying germanium concentrationsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 26, 2018·3 cites·17 claims
- 1479US9735158B2Semiconductor devices having bridge layer and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 15, 2017·2 cites·20 claims
- 1579US9412731B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 9, 2016·5 cites·20 claims
- 1677US9252244B2Methods of selectively growing source/drain regions of fin field effect transistor and method of manufacturing semiconductor device including a fin field effect transistorSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 2, 2016·4 cites·19 claims
- 1775US12211941B2Semiconductor device with channel pattern formed of stacked semiconductor regions and gate electrode partsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 28, 2025·1 cites·20 claims
- 1874US9530870B2Methods of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 27, 2016·2 cites·16 claims
- 1970US10062754B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 28, 2018·2 cites·17 claims
- 2063US8409947B2Method of manufacturing semiconductor device having stress creating layerKIM JIN-BUM·Filed 2010·Granted Apr 2, 2013·1 cites·9 claims
- 2160US8877583B2Method of manufacturing a semiconductor deviceKIM JIN-BUM·Filed 2012·Granted Nov 4, 2014·1 cites·10 claims
- 2259US11469237B2Semiconductor devices with layers commonly contacting fins and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 11, 2022·0 cites·15 claims
- 2359US8361860B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Jan 29, 2013·1 cites·15 claims
- 2458US10147723B2Semiconductor devices having bridge layer and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 4, 2018·0 cites·20 claims
- 2558US2009327308A1Systems and methods for providing a consumption networkBANK OF AMERICA·Filed 2008·Application pending·0 cites
- 2657US10629604B2Method of manufacturing semiconductor device having stressorSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 21, 2020·0 cites·15 claims
- 2756US10319859B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 11, 2019·0 cites·20 claims
- 2856US9755076B2Semiconductor devices having source/drain regions with strain-inducing layers and methods of manufacturing such semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 5, 2017·0 cites·6 claims
- 2955US10790361B2Semiconductor device having a fin structure and a manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 29, 2020·0 cites·19 claims
- 3055US9553192B2Semiconductor devices having source/drain regions with strain-inducing layers and methods of manufacturing such semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 24, 2017·0 cites·18 claims
- 3155US2010001349A1Semiconductor deviceKIM JIN-BUM·Filed 2009·Application pending·0 cites
- 3253US9853160B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 26, 2017·0 cites·20 claims
- 3351US11476327B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 18, 2022·0 cites·20 claims
- 3451US9698244B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 4, 2017·0 cites·18 claims
- 3551US8716093B2Methods of manufacturing a semiconductor deviceKIM JIN-BUM·Filed 2012·Granted May 6, 2014·0 cites·14 claims
- 3651US2019198639A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 3748US10304840B2Semiconductor device having stressor and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 28, 2019·0 cites·20 claims
- 3847US12349404B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 3947US2017271479A1Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 4042US2014374827A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 4136US9112054B2Methods of manufacturing semiconductor devicesLEE KWAN-HEUM·Filed 2011·Granted Aug 18, 2015·0 cites·20 claims
- 4233US2016322495A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 4331US8431462B2Methods of manufacturing semiconductor devicesLEE KWAN-HEUM·Filed 2011·Granted Apr 30, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →