Inventor · disambiguated record
Kwangmo Chris Lim
Also filed as: LIM KWANGMO · LIM KWANGMO CHRIS
20 granted patents·3 pending applications·19 citations·filing 2016–2024
90Inventor score
Files withWOLFSPEED INC7INTEL CORP6MACOM TECH SOLUTIONS HOLDINGS INC5AMKOR TECH SINGAPORE HOLDING PTE LTD2CREE INC2
Top patents by PatentIndex Score
23 records- 0196US11533024B2Multi-zone radio frequency transistor amplifiersWOLFSPEED INC·Filed 2020·Granted Dec 20, 2022·5 cites·22 claims
- 0290US11837559B2Group III nitride-based radio frequency amplifiers having back side source, gate and/or drain terminalsCREE INC·Filed 2021·Granted Dec 5, 2023·2 cites·20 claims
- 0387US11101222B2Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layersINTEL CORP·Filed 2016·Granted Aug 24, 2021·4 cites·25 claims
- 0485US10872872B2Package substrate with high-density interconnect layer having pillar and via connections for fan out scalingINTEL CORP·Filed 2016·Granted Dec 22, 2020·4 cites·17 claims
- 0585US2025125277A1Panel level packaging for multi-die products interconnected with very high density (vhd) interconnect layersINTEL CORP·Filed 2024·Application pending·0 cites
- 0682US11532584B2Package substrate with high-density interconnect layer having pillar and via connections for fan out scalingINTEL CORP·Filed 2020·Granted Dec 20, 2022·1 cites·18 claims
- 0781US12218071B2Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layersINTEL CORP·Filed 2023·Granted Feb 4, 2025·0 cites·28 claims
- 0880US11356070B2RF amplifiers having shielded transmission line structuresWOLFSPEED INC·Filed 2020·Granted Jun 7, 2022·1 cites·20 claims
- 0978US10600755B2Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECHNOLOGY INC·Filed 2017·Granted Mar 24, 2020·2 cites·19 claims
- 1074US12113490B2Group III nitride-based radio frequency transistor amplifiers having source, gate and/or drain conductive viasMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2023·Granted Oct 8, 2024·0 cites·21 claims
- 1174US11735531B2Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layersINTEL CORP·Filed 2021·Granted Aug 22, 2023·0 cites·5 claims
- 1269US12034419B2RF amplifiers having shielded transmission line structuresMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2022·Granted Jul 9, 2024·0 cites·17 claims
- 1369US2024071962A1Stacked rf circuit topology using transistor die with through silicon carbide vias on gate and/or drainWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1467US11863130B2Group III nitride-based radio frequency transistor amplifiers having source, gate and/or drain conductive viasWOLFSPEED INC·Filed 2021·Granted Jan 2, 2024·0 cites·24 claims
- 1567US11594512B2Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 1664US10943884B2Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Mar 9, 2021·0 cites·20 claims
- 1763US11881464B2Stacked RF circuit topology using transistor die with through silicon carbide vias on gate and/or drainWOLFSPEED INC·Filed 2021·Granted Jan 23, 2024·0 cites·20 claims
- 1860US12500562B2RF amplifier devices and methods of manufacturing including modularized designs with flip chip interconnectionsMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2022·Granted Dec 16, 2025·0 cites·24 claims
- 1956US12394733B2Stacked RF circuit topologyMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2021·Granted Aug 19, 2025·0 cites·22 claims
- 2056US11837457B2Packaging for RF transistor amplifiersCREE INC·Filed 2020·Granted Dec 5, 2023·0 cites·24 claims
- 2152US11670605B2RF amplifier devices including interconnect structures and methods of manufacturingWOLFSPEED INC·Filed 2020·Granted Jun 6, 2023·0 cites·21 claims
- 2251US12166003B2RF amplifier devices including top side contacts and methods of manufacturingMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2020·Granted Dec 10, 2024·0 cites·18 claims
- 2350US2023075505A1Metal pillar connection topologies for heterogeneous packagingWOLFSPEED INC·Filed 2021·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kwangmo Chris Lim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →