Inventor · disambiguated record
Kwan Wook Roh
Also filed as: ROH KWAN WOOK
7 granted patents·6 pending applications·2 citations·filing 2019–2024
72Inventor score
Files withAPPLIED MATERIALS INC13
Top patents by PatentIndex Score
13 records- 0193US11634830B2Electrochemical depositions of nanotwin copper materialsAPPLIED MATERIALS INC·Filed 2021·Granted Apr 25, 2023·2 cites·17 claims
- 0282US2025341018A1Gas atomized fluid clean of electroplating chuck in maintenance chamberAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0381US2025341017A1Gas atomized fluid clean of electroplating chuck in maintenance chamberAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0476US12404597B2Electrochemical depositions of nanotwin copper materialsAPPLIED MATERIALS INC·Filed 2023·Granted Sep 2, 2025·0 cites·18 claims
- 0576US2025092559A1Electrochemical deposition systems with enhanced crystallization prevention featuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0669US2019345624A1Systems and methods for removing contaminants in electroplating systemsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 0768US11984358B2Systems and methods for improving within die co-planarity uniformityAPPLIED MATERIALS INC·Filed 2022·Granted May 14, 2024·0 cites·18 claims
- 0867US2023272546A1Electroplating systems and methods with increased metal ion concentrationsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0966US12195867B2Electrochemical deposition systems with enhanced crystallization prevention featuresAPPLIED MATERIALS INC·Filed 2021·Granted Jan 14, 2025·0 cites·7 claims
- 1066US11686005B1Electroplating systems and methods with increased metal ion concentrationsAPPLIED MATERIALS INC·Filed 2022·Granted Jun 27, 2023·0 cites·13 claims
- 1164US2023313406A1Electroplating systems and methods with increased metal ion concentrationsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1261US11367653B2Systems and methods for improving within die co-planarity uniformityAPPLIED MATERIALS INC·Filed 2019·Granted Jun 21, 2022·0 cites·7 claims
- 1360US11973034B2Nanotwin copper materials in semiconductor devicesAPPLIED MATERIALS INC·Filed 2021·Granted Apr 30, 2024·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →