Inventor · disambiguated record
Kyong-Soon Cho
Also filed as: CHO KYONG-SOON
18 granted patents·5 pending applications·67 citations·filing 2009–2023
92Inventor score
Top patents by PatentIndex Score
23 records- 0191US9113545B2Tape wiring substrate and chip-on-film package including the sameHAN SANG-UK·Filed 2012·Granted Aug 18, 2015·15 cites·16 claims
- 0289US10978409B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 13, 2021·6 cites·18 claims
- 0389US8222089B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameCHOI KYOUNG-SEI·Filed 2011·Granted Jul 17, 2012·10 cites·12 claims
- 0482US7915727B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 29, 2011·8 cites·20 claims
- 0580US9280182B2Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 8, 2016·5 cites·20 claims
- 0680US8575735B2Semiconductor chip and film and TAB package comprising the chip and filmCHO YOUNG-SANG·Filed 2011·Granted Nov 5, 2013·6 cites·12 claims
- 0778US9059162B2Chip on film (COF) substrate, COF package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 16, 2015·5 cites·20 claims
- 0876US9865552B2Wafer level packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 9, 2018·3 cites·15 claims
- 0973US8952510B2Semiconductor chip and film and tab package comprising the chip and filmSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 10, 2015·3 cites·21 claims
- 1070US10262933B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 16, 2019·1 cites·18 claims
- 1167US9305990B2Chip-on-film package and device assembly including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 5, 2016·2 cites·18 claims
- 1265US10105102B2Package for processing sensed-data, sensed-data processor, and system for processing sensed-dataSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 23, 2018·1 cites·10 claims
- 1363US8629547B2Semiconductor chip packageCHO KYONG-SOON·Filed 2011·Granted Jan 14, 2014·2 cites·19 claims
- 1462US11664330B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 1559US10600729B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 24, 2020·0 cites·20 claims
- 1658US2024120354A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1751US2010005652A1Method of manufacturing a wiring substrate, method of manufacturing a tape package and method of manufacturing a display deviceSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1848US2016162091A1Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 1941US2013240917A1Semiconductor package having a conductive layer for electrostatic discharge and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2040US10672694B2Printed circuit board, semiconductor package including the printed circuit board, and method of manufacturing the printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 2, 2020·0 cites·16 claims
- 2140US2013234310A1Flip chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 2238US8803301B2Semiconductor packageCHO KYONG-SOON·Filed 2012·Granted Aug 12, 2014·0 cites·20 claims
- 2330US9728497B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 8, 2017·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →