Inventor · disambiguated record
Kyuil Cho
Also filed as: Cho Kyuil
32 granted patents·8 pending applications·84 citations·filing 2016–2024
96Inventor score
Top patents by PatentIndex Score
40 records- 0198US10886232B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2020·Granted Jan 5, 2021·16 cites·19 claims
- 0298US10211072B2Method of reconstituted substrate formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Feb 19, 2019·37 cites·17 claims
- 0396US11264331B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2019·Granted Mar 1, 2022·10 cites·19 claims
- 0495US11715700B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2021·Granted Aug 1, 2023·2 cites·20 claims
- 0594US11257790B2High connectivity device stackingAPPLIED MATERIALS INC·Filed 2020·Granted Feb 22, 2022·3 cites·10 claims
- 0693US10937726B1Package structure with embedded coreAPPLIED MATERIALS INC·Filed 2020·Granted Mar 2, 2021·3 cites·20 claims
- 0785US12354968B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0885US10727083B1Method for via formation in flowable epoxy materials by micro-imprintAPPLIED MATERIALS INC·Filed 2019·Granted Jul 28, 2020·4 cites·20 claims
- 0985US10547040B2Energy storage device having an interlayer between electrode and electrolyte layerAPPLIED MATERIALS INC·Filed 2016·Granted Jan 28, 2020·2 cites·10 claims
- 1084US11367643B2Method for substrate registration and anchoring in inkjet printingAPPLIED MATERIALS INC·Filed 2020·Granted Jun 21, 2022·1 cites·14 claims
- 1184US11322381B2Method for substrate registration and anchoring in inkjet printingAPPLIED MATERIALS INC·Filed 2020·Granted May 3, 2022·1 cites·16 claims
- 1283US11887934B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 1382US11329003B2Anchoring dies using 3D printing to form reconstructed waferAPPLIED MATERIALS INC·Filed 2020·Granted May 10, 2022·1 cites·17 claims
- 1480US11388822B2Methods for improved polymer-copper adhesionAPPLIED MATERIALS INC·Filed 2020·Granted Jul 12, 2022·1 cites·20 claims
- 1579US11798831B2Method for substrate registration and anchoring in inkjet printingAPPLIED MATERIALS INC·Filed 2022·Granted Oct 24, 2023·0 cites·15 claims
- 1678US12388049B2High connectivity device stackingAPPLIED MATERIALS INC·Filed 2023·Granted Aug 12, 2025·0 cites·16 claims
- 1778US11281094B2Method for via formation by micro-imprintingAPPLIED MATERIALS INC·Filed 2018·Granted Mar 22, 2022·2 cites·17 claims
- 1876US11521935B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Dec 6, 2022·0 cites·20 claims
- 1975US11258045B2Methods of forming stretchable encapsulation for electronic displaysAPPLIED MATERIALS INC·Filed 2019·Granted Feb 22, 2022·1 cites·19 claims
- 2075US2022328336A1Apparatus for substrate registration and anchoring in inkjet printingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2174US11476202B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 2274US11398433B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2020·Granted Jul 26, 2022·0 cites·19 claims
- 2373US12374611B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Jul 29, 2025·0 cites·24 claims
- 2473US11881447B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Jan 23, 2024·0 cites·18 claims
- 2573US11264333B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2020·Granted Mar 1, 2022·0 cites·20 claims
- 2672US11742330B2High connectivity device stackingAPPLIED MATERIALS INC·Filed 2022·Granted Aug 29, 2023·0 cites·8 claims
- 2771US12087679B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2020·Granted Sep 10, 2024·0 cites·9 claims
- 2870US11925073B2Stretchable polymer and dielectric layers for electronic displaysAPPLIED MATERIALS INC·Filed 2021·Granted Mar 5, 2024·0 cites·18 claims
- 2970US2022293888A1Encapsulation having polymer and dielectric layers for electronic displaysAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3069US11211439B2Stretchable polymer and dielectric layers for electronic displaysAPPLIED MATERIALS INC·Filed 2019·Granted Dec 28, 2021·0 cites·19 claims
- 3168US11362307B2Encapsulation having polymer and dielectric layers for electronic displaysAPPLIED MATERIALS INC·Filed 2019·Granted Jun 14, 2022·0 cites·21 claims
- 3268US2022246888A1Method of forming stretchable encapsulation for electronic displaysAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3364US11862546B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2019·Granted Jan 2, 2024·0 cites·19 claims
- 3464US2022171281A1Method for via formation by micro-imprintingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3559US2019181019A1Method of reconstituted substrate formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 3652US11705365B2Methods of micro-via formation for advanced packagingAPPLIED MATERIALS INC·Filed 2021·Granted Jul 18, 2023·0 cites·14 claims
- 3752US2024222142A1Efficient autocatalytic metallization of polymeric surfacesAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3847US2025035232A1Automatic magnetic valve, system, and methodsUNIV IOWA STATE RES FOUND INC·Filed 2024·Application pending·0 cites
- 3944US11342256B2Method of fine redistribution interconnect formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2019·Granted May 24, 2022·0 cites·18 claims
- 4041US2019139788A1Apparatus and methods for packaging semiconductor diesAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kyuil Cho files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →