Inventor · disambiguated record
Kyung Moon Jung
Also filed as: JUNG KYUNG MOON
19 granted patents·5 pending applications·17 citations·filing 2007–2025
89Inventor score
Files withSAMSUNG ELECTRONICS CO LTD11SAMSUNG ELECTRO MECH10CHOI DONG-HOON1HAN EUN-GU1JUNG KYUNG MOON1
Top patents by PatentIndex Score
24 records- 0186US9935068B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Apr 3, 2018·6 cites·16 claims
- 0280US10998362B2Fan-out sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 4, 2021·1 cites·10 claims
- 0380US10790239B2Semiconductor package and board for mounting the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 29, 2020·3 cites·28 claims
- 0477US8742025B2Adhesive composition and polarizing plate comprising the sameJUNG KYUNG MOON·Filed 2011·Granted Jun 3, 2014·4 cites·19 claims
- 0567US10504855B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 10, 2019·1 cites·14 claims
- 0666US10032697B2Electronic component package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jul 24, 2018·1 cites·15 claims
- 0765US2025287498A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2025·Application pending·0 cites
- 0860US11742308B2Semiconductor package for reducing stress to redistribution viaSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 29, 2023·0 cites·16 claims
- 0960US8420231B2Iridium phosphorescent dendrimer, method of preparing the same and electroluminescent device including the iridium phosphorescent dendrimerCHOI DONG-HOON·Filed 2009·Granted Apr 16, 2013·1 cites·9 claims
- 1058US11081283B2Multi-layered ceramic electronic component and mounting board thereofSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 3, 2021·0 cites·19 claims
- 1158US2025194001A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1257US12260994B2Composite electronic component with electrode using epoxySAMSUNG ELECTRO MECH·Filed 2022·Granted Mar 25, 2025·0 cites·19 claims
- 1356US10700110B2Fan-out sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 30, 2020·0 cites·19 claims
- 1453US10887983B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2019·Granted Jan 5, 2021·0 cites·20 claims
- 1553US10714440B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 14, 2020·0 cites·19 claims
- 1653US7915428B2Photorefractive dendron compound, photorefractive dendrimer compound, method of preparing the same, photorefractive device using the same, and method of manufacturing the deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 29, 2011·0 cites·10 claims
- 1752US12183515B2Ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Dec 31, 2024·0 cites·21 claims
- 1852US10734342B2Semiconductor package for reducing stress to redistribution viaSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 4, 2020·0 cites·16 claims
- 1951US2018233432A1Electronic component package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 2050US10403588B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 3, 2019·0 cites·20 claims
- 2149US2014295108A1Adhesive composition, polarizing plate and liquid crystal display device comprising the sameHAN EUN-GU·Filed 2012·Application pending·0 cites
- 2248US10396049B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 27, 2019·0 cites·23 claims
- 2343US11244921B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 8, 2022·0 cites·20 claims
- 2432US2015323002A1Hydrodynamic bearing device, spindle motor having the same, and recording disk driving deviceSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →