Inventor · disambiguated record
Kyungeun Kim
Also filed as: KIM KYUNGEUN
4 granted patents·7 pending applications·7 citations·filing 2011–2025
64Inventor score
Top patents by PatentIndex Score
11 records- 0188US11746259B2Optical module and method for manufacturing the sameOPROCESSOR INC·Filed 2020·Granted Sep 5, 2023·2 cites·8 claims
- 0281US11970642B2Method for bonding objects using thermoset polyimide layersOPROCESSOR INC·Filed 2023·Granted Apr 30, 2024·0 cites·1 claims
- 0378US8710640B2Integrated circuit packaging system with heat slug and method of manufacture thereofCHOI DAESIK·Filed 2011·Granted Apr 29, 2014·5 cites·18 claims
- 0459US2023369165A1Heat spreader for use with a semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0555US11249261B2Optical module and optical communication network system having the sameOPROCESSOR INC·Filed 2019·Granted Feb 15, 2022·0 cites·20 claims
- 0652US2024355773A1Semiconductor device and a method for forming a semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0751US2024030088A1Heat spreader assembly for use with a semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0845US2023402344A1Heat spreader for use with a semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0945US2023411263A1Modular semiconductor devices and electronic devices incorporating the sameSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1044US2025239531A1Electronic device and a method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 1137US2013113118A1Semiconductor Device and Method of Forming Sloped Surface in Patterning Layer to Separate Bumps of Semiconductor Die from Patterning LayerKIM MINJUNG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →