Inventor · disambiguated record
Kyung-Bum Koo
Also filed as: KOO KYUNG-BUM
7 granted patents·7 pending applications·69 citations·filing 2001–2018
81Inventor score
Top patents by PatentIndex Score
14 records- 0189US6908848B2Method for forming an electrical interconnection providing improved surface morphology of tungstenSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 21, 2005·55 cites·7 claims
- 0270US8366827B2Chamber inserts and apparatuses for processing a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 5, 2013·5 cites·5 claims
- 0368US10832965B2Fin reveal forming STI regions having convex shape between finsGLOBALFOUNDRIES INC·Filed 2018·Granted Nov 10, 2020·1 cites·14 claims
- 0459US7494917B2Method for forming an electrical interconnection providing improved surface morphology of tungstenSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 24, 2009·1 cites·7 claims
- 0555US6451691B2Methods of manufacturing a metal pattern of a semiconductor device which include forming nitride layer at exposed sidewalls of Ti layer of the patternSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 17, 2002·7 cites·18 claims
- 0646US2006096541A1Apparatus and method of forming a layer on a semiconductor substrateSEO JUNG-HUN·Filed 2005·Application pending·0 cites
- 0743US10355104B2Single-curvature cavity for semiconductor epitaxyGLOBALFOUNDRIES INC·Filed 2017·Granted Jul 16, 2019·0 cites·14 claims
- 0843US9412842B2Method for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 9, 2016·0 cites·20 claims
- 0942US2006292810A1Method of manufacturing a capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1041US2014183720A1Methods of manufacturing integrated circuits having a compressive nitride layerGLOBALFOUNDRIES INC·Filed 2012·Application pending·0 cites
- 1140US2007042132A1Method of forming plasma and method of forming a layer using the sameSEO JUNG-HUN·Filed 2006·Application pending·0 cites
- 1239US2006137607A1Combination of showerhead and temperature control means for controlling the temperature of the showerhead, and deposition apparatus having the sameSEO JUNG-HUN·Filed 2005·Application pending·0 cites
- 1338US2006128127A1Method of depositing a metal compound layer and apparatus for depositing a metal compound layerSEO JUNG-HUN·Filed 2005·Application pending·0 cites
- 1433US2002076924A1Method for forming an electrical interconnection providing improved surface morphololgy of tungstenSAMSUNG ELECTRONICS CO LTD·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →