Inventor · disambiguated record
Kyoko Kuroda
Also filed as: KURODA KYOKO
3 granted patents·1 pending application·8 citations·filing 2010–2013
59Inventor score
Top patents by PatentIndex Score
4 records- 0182US9457406B2Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid compositionNAKAKO HIDEO·Filed 2010·Granted Oct 4, 2016·5 cites·13 claims
- 0280US9676969B2Composition set, conductive substrate and method of producing the same, and conductive adhesive compositionNAKAKO HIDEO·Filed 2012·Granted Jun 13, 2017·3 cites·18 claims
- 0341US9550940B2Etching materialHITACHI CHEMICAL CO LTD·Filed 2013·Granted Jan 24, 2017·0 cites·9 claims
- 0439US2012170241A1Printing ink, metal nanoparticles used in the same, wiring, circuit board, and semiconductor packageNAKAKO HIDEO·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kyoko Kuroda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →