Inventor · disambiguated record
Kyu Oh Lee
Also filed as: LEE KYU N · LEE KYU OH
66 granted patents·18 pending applications·133 citations·filing 2005–2025
98Inventor score
Top patents by PatentIndex Score
84 records- 0196US11664290B2Package with underfill containment barrierINTEL CORP·Filed 2021·Granted May 30, 2023·3 cites·20 claims
- 0293US9917044B2Package with bi-layered dielectric structureINTEL CORP·Filed 2015·Granted Mar 13, 2018·12 cites·25 claims
- 0393US9505607B2Methods of forming sensor integrated packages and structures formed therebyINTEL CORP·Filed 2015·Granted Nov 29, 2016·8 cites·22 claims
- 0493US9501068B2Integration of pressure sensors into integrated circuit fabrication and packagingINTEL CORP·Filed 2016·Granted Nov 22, 2016·6 cites·20 claims
- 0592US9607947B2Reliable microstrip routing for electronics componentsKARHADE OMKAR G·Filed 2016·Granted Mar 28, 2017·8 cites·9 claims
- 0691US11521914B2Microelectronic assemblies having a cooling channelINTEL CORP·Filed 2018·Granted Dec 6, 2022·8 cites·13 claims
- 0791US11387224B2Phase change material in substrate cavityINTEL CORP·Filed 2018·Granted Jul 12, 2022·7 cites·20 claims
- 0891US9260294B2Integration of pressure or inertial sensors into integrated circuit fabrication and packagingLEE KYU OH·Filed 2013·Granted Feb 16, 2016·9 cites·18 claims
- 0990US9837341B1Tin-zinc microbump structuresINTEL CORP·Filed 2016·Granted Dec 5, 2017·6 cites·17 claims
- 1090US9041205B2Reliable microstrip routing for electronics componentsKARHADE OMKAR G·Filed 2013·Granted May 26, 2015·10 cites·8 claims
- 1189US11158558B2Package with underfill containment barrierINTEL CORP·Filed 2016·Granted Oct 26, 2021·5 cites·16 claims
- 1288US10373951B1Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2018·Granted Aug 6, 2019·4 cites·23 claims
- 1387US10692847B2Inorganic interposer for multi-chip packagingINTEL CORP·Filed 2015·Granted Jun 23, 2020·7 cites·9 claims
- 1485US11410921B2Methods to incorporate thin film capacitor sheets (TFC-S) in the build-up filmsINTEL CORP·Filed 2018·Granted Aug 9, 2022·4 cites·24 claims
- 1585US10297563B2Copper seed layer and nickel-tin microbump structuresINTEL CORP·Filed 2016·Granted May 21, 2019·4 cites·11 claims
- 1684US12327773B2Package with underfill containment barrierINTEL CORP·Filed 2024·Granted Jun 10, 2025·0 cites·20 claims
- 1784US12224264B2Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrateINTEL CORP·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 1882US10643994B2Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2019·Granted May 5, 2020·2 cites·21 claims
- 1982US10468352B2Semiconductor packages with embedded bridge interconnectsLEE KYU OH·Filed 2014·Granted Nov 5, 2019·5 cites·22 claims
- 2082US9791470B2Magnet placement for integrated sensor packagesINTEL CORP·Filed 2013·Granted Oct 17, 2017·4 cites·20 claims
- 2181US9865568B2Integrated circuit structures with recessed conductive contacts for package on packageINTEL CORP·Filed 2015·Granted Jan 9, 2018·3 cites·20 claims
- 2280US11935805B2Package with underfill containment barrierINTEL CORP·Filed 2023·Granted Mar 19, 2024·0 cites·20 claims
- 2380US11393745B2Semiconductor packages with embedded interconnectsINTEL CORP·Filed 2017·Granted Jul 19, 2022·3 cites·18 claims
- 2478US2025149501A1Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrateINTEL CORP·Filed 2025·Application pending·0 cites
- 2577US11581271B2Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrateINTEL CORP·Filed 2019·Granted Feb 14, 2023·2 cites·27 claims
- 2677US11557489B2Cavity structures in integrated circuit package supportsINTEL CORP·Filed 2018·Granted Jan 17, 2023·2 cites·20 claims
- 2777US11251113B2Methods of embedding magnetic structures in substratesINTEL CORP·Filed 2017·Granted Feb 15, 2022·2 cites·16 claims
- 2877US10424561B2Integrated circuit structures with recessed conductive contacts for package on packageINTEL CORP·Filed 2018·Granted Sep 24, 2019·2 cites·25 claims
- 2976US9391025B2Reliable microstrip routing for electronics componentsKARHADE OMKAR G·Filed 2015·Granted Jul 12, 2016·2 cites·8 claims
- 3075US11842981B2Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrateINTEL CORP·Filed 2021·Granted Dec 12, 2023·0 cites·20 claims
- 3174US11217534B2Galvanic corrosion protection for semiconductor packagesINTEL CORP·Filed 2017·Granted Jan 4, 2022·2 cites·20 claims
- 3273US10468374B2Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrateINTEL CORP·Filed 2017·Granted Nov 5, 2019·1 cites·22 claims
- 3372US12154715B2Methods to selectively embed magnetic materials in substrate and corresponding structuresINTEL CORP·Filed 2022·Granted Nov 26, 2024·0 cites·25 claims
- 3472US11735537B2Methods to embed magnetic material as first layer on coreless substrates and corresponding structuresINTEL CORP·Filed 2022·Granted Aug 22, 2023·0 cites·23 claims
- 3571US11443892B2Substrate assembly with encapsulated magnetic featureINTEL CORP·Filed 2018·Granted Sep 13, 2022·1 cites·17 claims
- 3670US12288744B2Microelectronic assemblies having conductive structures with different thicknesses on a core substrateINTEL CORP·Filed 2022·Granted Apr 29, 2025·0 cites·11 claims
- 3770US11862552B2Methods of embedding magnetic structures in substratesINTEL CORP·Filed 2022·Granted Jan 2, 2024·0 cites·7 claims
- 3870US10777514B2Techniques for an inductor at a second level interfaceINTEL CORP·Filed 2018·Granted Sep 15, 2020·1 cites·16 claims
- 3969US10971492B2Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2020·Granted Apr 6, 2021·0 cites·21 claims
- 4068US11901115B2Substrate assembly with encapsulated magnetic featureINTEL CORP·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 4166US11942406B2Semiconductor packages with embedded interconnectsINTEL CORP·Filed 2022·Granted Mar 26, 2024·0 cites·20 claims
- 4266US11031360B2Techniques for an inductor at a second level interfaceINTEL CORP·Filed 2020·Granted Jun 8, 2021·0 cites·13 claims
- 4364US11139264B2Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrateINTEL CORP·Filed 2019·Granted Oct 5, 2021·0 cites·20 claims
- 4464US2022230800A1Techniques for an inductor at a first level interfaceINTEL CORP·Filed 2022·Application pending·0 cites
- 4560US11651885B2Magnetic core inductorsINTEL CORP·Filed 2017·Granted May 16, 2023·0 cites·11 claims
- 4657US9093313B2Device packaging with substrates having embedded lines and metal defined padsINTEL CORP·Filed 2014·Granted Jul 28, 2015·0 cites·3 claims
- 4757US2024421043A1Substrate process flow for enabling substrate to die hybrid bondingINTEL CORP·Filed 2023·Application pending·0 cites
- 4856US11450471B2Methods to selectively embed magnetic materials in substrate and corresponding structuresINTEL CORP·Filed 2018·Granted Sep 20, 2022·0 cites·19 claims
- 4956US11322290B2Techniques for an inductor at a first level interfaceINTEL CORP·Filed 2018·Granted May 3, 2022·0 cites·6 claims
- 5056US10446500B2Semiconductor packages with embedded bridge interconnectsINTEL CORP·Filed 2018·Granted Oct 15, 2019·0 cites·11 claims
Showing the top 50 of 84 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Kyu Oh Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →