Inventor · disambiguated record
Kyu-Ha Lee
Also filed as: LEE KYU · LEE KYU H · LEE KYU HA
45 granted patents·17 pending applications·217 citations·filing 2002–2019
97Inventor score
Top patents by PatentIndex Score
62 records- 0196US9865581B2Method of fabricating multi-substrate semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 9, 2018·25 cites·20 claims
- 0293US10750918B2Cleaning robot and controlling method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 25, 2020·13 cites·14 claims
- 0392US8952543B2Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devicesLEE HO-JIN·Filed 2012·Granted Feb 10, 2015·15 cites·25 claims
- 0491US9799619B2Electronic device having a redistribution areaSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 24, 2017·9 cites·20 claims
- 0591US9087644B2Multilayer ceramic electronic component and fabrication method thereofJEON BYUNG JUN·Filed 2012·Granted Jul 21, 2015·11 cites·17 claims
- 0691US8941972B2Multilayer ceramic electronic componentPARK MYUNG JUN·Filed 2012·Granted Jan 27, 2015·9 cites·24 claims
- 0791US8837112B2Multilayer ceramic electronic component and method of fabricating the sameGU HYUN HEE·Filed 2012·Granted Sep 16, 2014·15 cites·12 claims
- 0890US9070748B2Semiconductor devices having through-vias and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 30, 2015·10 cites·14 claims
- 0988US8927426B2Semiconductor devices having through-vias and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 6, 2015·10 cites·14 claims
- 1087US8941216B2Semiconductor devices having through-vias and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 27, 2015·7 cites·7 claims
- 1186US9691685B2Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 27, 2017·4 cites·20 claims
- 1286US8842413B2Multilayered ceramic electronic componentPARK MYUNG JUN·Filed 2012·Granted Sep 23, 2014·8 cites·5 claims
- 1385US9520234B2Multilayer ceramic capacitor, manufacturing method thereof and board for mounting the same thereonSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 13, 2016·8 cites·16 claims
- 1483US9236349B2Semiconductor device including through via structures and redistribution structuresSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 12, 2016·6 cites·20 claims
- 1583US9171753B2Semiconductor devices having conductive via structures and methods for fabricating the sameLEE HO-JIN·Filed 2013·Granted Oct 27, 2015·7 cites·19 claims
- 1681US8941971B2Multilayer ceramic electronic component and fabrication method thereofPARK MYUNG JUN·Filed 2012·Granted Jan 27, 2015·4 cites·9 claims
- 1780US9165712B2Multilayer ceramic electronic component and fabrication method thereofJEON BYUNG JUN·Filed 2012·Granted Oct 20, 2015·4 cites·3 claims
- 1878US10500894B2Robot cleanerSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 10, 2019·3 cites·19 claims
- 1977US8564139B2Semiconductor devices including protected barrier layersLEE HO-JIN·Filed 2012·Granted Oct 22, 2013·4 cites·18 claims
- 2075US9502274B2Wafer loaders having buffer zonesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 22, 2016·3 cites·6 claims
- 2174US9218909B2Multi-layered ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 22, 2015·2 cites·12 claims
- 2274US8767375B2Multilayer ceramic electronic component and method of fabricating the samePARK MYUNG JUN·Filed 2012·Granted Jul 1, 2014·2 cites·14 claims
- 2373US8114772B2Method of manufacturing the semiconductor deviceLEE KYU-HA·Filed 2010·Granted Feb 14, 2012·6 cites·20 claims
- 2471US8872351B2Semiconductor devices having through electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 28, 2014·3 cites·6 claims
- 2571US7035888B2Digital sampling rate converter for compensation for drop of in-band signalSAMSUNG THALES CO LTD·Filed 2004·Granted Apr 25, 2006·13 cites·3 claims
- 2670US9305705B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 5, 2016·1 cites·32 claims
- 2768US11737639B2DishwasherSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 29, 2023·1 cites·14 claims
- 2868US9793165B2Methods of fabricating semiconductor devicesJEONG SEYOUNG·Filed 2012·Granted Oct 17, 2017·3 cites·10 claims
- 2967US10248125B2Cleaning robot and method of controlling the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 2, 2019·2 cites·16 claims
- 3066US7960273B2Metal interconnection of a semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 14, 2011·4 cites·17 claims
- 3162US9257234B2Multilayer ceramic capacitor and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2014·Granted Feb 9, 2016·1 cites·14 claims
- 3262US2016012741A1Edutainment system for supporting linkage of electronic book and gameWEDU COMM CO LTD·Filed 2014·Application pending·0 cites
- 3355US11871891B2Cleaning robot and controlling method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 16, 2024·0 cites·12 claims
- 3454US9514882B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 6, 2016·0 cites·23 claims
- 3554US9362172B2Semiconductor devices having through-vias and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 7, 2016·0 cites·16 claims
- 3651US2016012742A1Apparatus for providing game interworking with electronic bookWEDU COMM CO LTD·Filed 2014·Application pending·0 cites
- 3750US11464374B2Robot cleanerSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 11, 2022·0 cites·14 claims
- 3850US7099420B2Block interpolation filter structure using lookup tableSAMSUNG THALES CO LTD·Filed 2002·Granted Aug 29, 2006·4 cites·5 claims
- 3949US9972439B2Ceramic electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted May 15, 2018·0 cites·10 claims
- 4048US11417536B2Method for wafer planarization and an image sensor made by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 16, 2022·0 cites·18 claims
- 4148US2015116895A1Conductive paste composition for external electrode, multilayer ceramic electronic component using the same, and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4246US9673383B2Multilayer ceramic electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Jun 6, 2017·0 cites·17 claims
- 4346US8792223B2Multilayer ceramic electronic componentGU HYUN HEE·Filed 2012·Granted Jul 29, 2014·0 cites·14 claims
- 4446US2015014900A1Composite conductive powder, conductive paste for external electrode including the same, and manufacturing method of multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4546US2015016024A1Cathode active material having core-shell structure and producing method thereofKOREA INST SCI & TECH·Filed 2013·Application pending·0 cites
- 4646US2006164970A1Transmitter and receiver in DBLAST systemUNIV YONSEI SEOUL·Filed 2005·Application pending·0 cites
- 4745US2014063684A1Conductive paste composition for external electrode, multilayered ceramic component including the same and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 4844US9583373B2Wafer carrier having cavitySAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 28, 2017·0 cites·13 claims
- 4944US2015243637A1Semiconductor devices having through-vias and methods for fabricating the sameKANG PIL-KYU·Filed 2015·Application pending·0 cites
- 5044US2014199810A1Methods for Forming Semiconductor Devices Using Sacrificial LayersSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
Showing the top 50 of 62 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Kyu-Ha Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →