Inventor · disambiguated record
Lai Chien-Hung
Also filed as: CHIEN-HUNG LAI
1 granted patent·3 pending applications·107 citations·filing 2001–2001
53Inventor score
Files withWALSIN ADVANCED ELECTRONICS4
Top patents by PatentIndex Score
4 records- 0187US6385049B1Multi-board BGA packageWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted May 7, 2002·107 cites·13 claims
- 0233US2003001250A1TCP optical deviceWALSIN ADVANCED ELECTRONICS·Filed 2001·Application pending·0 cites
- 0330US2002173074A1Method for underfilling bonding gap between flip-chip and circuit substrateWALSIN ADVANCED ELECTRONICS·Filed 2001·Application pending·0 cites
- 0430US2003006055A1Semiconductor package for fixed surface mountingWALSIN ADVANCED ELECTRONICS·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →