Inventor · disambiguated record
Laura Wills Mirkarimi
Also filed as: MIRKARIMI LAURA · MIRKARIMI LAURA W · MIRKARIMI LAURA WILLS
82 granted patents·41 pending applications·1,933 citations·filing 1999–2025
99Inventor score
Files withADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC63INVENSAS BONDING TECH INC19INVENSAS CORP19AGILENT TECHNOLOGIES INC7TESSERA INC5
Top patents by PatentIndex Score
123 records- 0199US8372741B1Method for package-on-package assembly with wire bonds to encapsulation surfaceINVENSAS CORP·Filed 2012·Granted Feb 12, 2013·121 cites·25 claims
- 0299US8076788B2Off-chip vias in stacked chipsHABA BELGACEM·Filed 2010·Granted Dec 13, 2011·74 cites·17 claims
- 0399US7901989B2Reconstituted wafer level stackingTESSERA INC·Filed 2008·Granted Mar 8, 2011·128 cites·16 claims
- 0498US11955463B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 9, 2024·6 cites·55 claims
- 0598US11955445B2Metal pads over TSVADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 9, 2024·5 cites·23 claims
- 0698US11855064B2Techniques for processing devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Dec 26, 2023·5 cites·32 claims
- 0798US11652083B2Processed stacked diesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted May 16, 2023·18 cites·29 claims
- 0898US11515279B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Nov 29, 2022·10 cites·22 claims
- 0998US11393779B2Large metal pads over TSVINVENSAS BONDING TECH INC·Filed 2019·Granted Jul 19, 2022·58 cites·15 claims
- 1098US11367652B2Microelectronic assembly from processed substrateINVENSAS BONDING TECH INC·Filed 2020·Granted Jun 21, 2022·62 cites·29 claims
- 1198US11355404B2Mitigating surface damage of probe pads in preparation for direct bonding of a substrateINVENSAS BONDING TECH INC·Filed 2020·Granted Jun 7, 2022·50 cites·22 claims
- 1298US11296053B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsINVENSAS BONDING TECH INC·Filed 2020·Granted Apr 5, 2022·41 cites·18 claims
- 1398US11195748B2Interconnect structures and methods for forming sameINVENSAS CORP·Filed 2018·Granted Dec 7, 2021·68 cites·28 claims
- 1498US11037919B2Techniques for processing devicesINVENSAS BONDING TECH INC·Filed 2020·Granted Jun 15, 2021·88 cites·29 claims
- 1598US11011494B2Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronicsINVENSAS BONDING TECH INC·Filed 2018·Granted May 18, 2021·133 cites·36 claims
- 1698US11004757B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2018·Granted May 11, 2021·117 cites·20 claims
- 1798US10879212B2Processed stacked diesINVENSAS BONDING TECH INC·Filed 2018·Granted Dec 29, 2020·155 cites·21 claims
- 1898US10790262B2Low temperature bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Sep 29, 2020·160 cites·13 claims
- 1998US10727219B2Techniques for processing devicesINVENSAS BONDING TECH INC·Filed 2019·Granted Jul 28, 2020·90 cites·22 claims
- 2098US9355997B2Integrated circuit assemblies with reinforcement frames, and methods of manufactureINVENSAS CORP·Filed 2014·Granted May 31, 2016·53 cites·22 claims
- 2198US9349706B2Method for package-on-package assembly with wire bonds to encapsulation surfaceINVENSAS CORP·Filed 2013·Granted May 24, 2016·47 cites·4 claims
- 2298US8772152B2Method for package-on-package assembly with wire bonds to encapsulation surfaceINVENSAS CORP·Filed 2013·Granted Jul 8, 2014·56 cites·20 claims
- 2397US12272677B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Apr 8, 2025·3 cites·21 claims
- 2497US12046571B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Jul 23, 2024·3 cites·5 claims
- 2597US12009338B2Dimension compensation control for directly bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Jun 11, 2024·4 cites·20 claims
- 2697US11626363B2Bonded structures with integrated passive componentADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2017·Granted Apr 11, 2023·16 cites·25 claims
- 2796US12132020B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Oct 29, 2024·2 cites·4 claims
- 2896US12100676B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Sep 24, 2024·2 cites·13 claims
- 2996US11955393B2Structures for bonding elements including conductive interface featuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Apr 9, 2024·3 cites·10 claims
- 3096US9691679B2Method for package-on-package assembly with wire bonds to encapsulation surfaceINVENSAS CORP·Filed 2016·Granted Jun 27, 2017·12 cites·3 claims
- 3195US12266545B1Structures and methods for integrated cold plate in XPUs and memoryADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Apr 1, 2025·2 cites·19 claims
- 3295US12205926B2TSV as padADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Jan 21, 2025·1 cites·22 claims
- 3395US11978681B2Mitigating surface damage of probe pads in preparation for direct bonding of a substrateADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted May 7, 2024·2 cites·31 claims
- 3495US11749645B2TSV as padADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2019·Granted Sep 5, 2023·8 cites·22 claims
- 3595US11664357B2Techniques for joining dissimilar materials in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2019·Granted May 30, 2023·15 cites·19 claims
- 3695US8680662B2Wafer level edge stackingHABA BELGACEM·Filed 2009·Granted Mar 25, 2014·38 cites·27 claims
- 3795US6560006B2Two-dimensional photonic crystal slab waveguideAGILENT TECHNOLOGIES INC·Filed 2001·Granted May 6, 2003·54 cites·20 claims
- 3894US12406975B2Techniques for processing devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Sep 2, 2025·1 cites·20 claims
- 3994US12068278B2Processed stacked diesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Aug 20, 2024·1 cites·21 claims
- 4094US8461672B2Reconstituted wafer stack packaging with after-applied pad extensionsHABA BELGACEM·Filed 2008·Granted Jun 11, 2013·27 cites·38 claims
- 4193US12341125B2Dimension compensation control for directly bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Jun 24, 2025·1 cites·20 claims
- 4293US10672654B2Microelectronic assembly from processed substrateINVENSAS BONDING TECH INC·Filed 2017·Granted Jun 2, 2020·6 cites·15 claims
- 4393US8853558B2Interconnect structureGUPTA DEBABRATA·Filed 2010·Granted Oct 7, 2014·35 cites·27 claims
- 4492US2025385141A1Mitigating surface damage of probe pads in preparation for direct bonding of a substrateADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 4591US12051621B2Microelectronic assembly from processed substrateADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Jul 30, 2024·1 cites·28 claims
- 4690US12300634B2Protective semiconductor elements for bonded structuresINVENSAS BONDING TECH INC·Filed 2022·Granted May 13, 2025·1 cites·29 claims
- 4790US11244916B2Low temperature bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Feb 8, 2022·4 cites·24 claims
- 4890US2025253294A1Tsv as padADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 4989US12322677B1Fluid channel geometry optimizations to improve cooling efficiencyADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Jun 3, 2025·1 cites·20 claims
- 5089US12283490B1Integrated cooling assemblies for advanced device packaging and methods of manufacturing the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Apr 22, 2025·1 cites·14 claims
Showing the top 50 of 123 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Laura Wills Mirkarimi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →