Inventor · disambiguated record
Lakshmi Supriya
Also filed as: SUPRIYA LAKSHMI
13 granted patents·3 pending applications·35 citations·filing 2006–2015
87Inventor score
Top patents by PatentIndex Score
16 records- 0185US7651021B2Microball attachment using self-assembly for substrate bumpingINTEL CORP·Filed 2007·Granted Jan 26, 2010·13 cites·20 claims
- 0284US9156973B2Meltprocessed fluoropolymer article and method for melt-processing fluoropolymersSUPRIYA LAKSHMI·Filed 2012·Granted Oct 13, 2015·6 cites·18 claims
- 0379US8383459B2Methods of processing a thermal interface materialINTEL CORP·Filed 2008·Granted Feb 26, 2013·10 cites·4 claims
- 0465US7611985B2Formation of holes in substrates using dewetting coatingsINTEL CORP·Filed 2006·Granted Nov 3, 2009·3 cites·22 claims
- 0557US9604210B2Controlled fluid delivery in a microelectronic packageINTEL CORP·Filed 2015·Granted Mar 28, 2017·0 cites·11 claims
- 0657US9101931B2Controlled fluid delivery in a microelectronic packageSUPRIYA LAKSHMI·Filed 2007·Granted Aug 11, 2015·0 cites·18 claims
- 0757US7727886B2Forming vias using sacrificial materialINTEL CORP·Filed 2007·Granted Jun 1, 2010·1 cites·11 claims
- 0856US8017498B2Multiple die structure and method of forming a connection between first and second dies in sameINTEL CORP·Filed 2008·Granted Sep 13, 2011·2 cites·15 claims
- 0950US7843075B2Apparatus and methods of forming an interconnect between a workpiece and substrateINTEL CORP·Filed 2008·Granted Nov 30, 2010·0 cites·20 claims
- 1047US8592972B2Thermally conductive device with a thermal interface materialSUPRIYA LAKSHMI·Filed 2013·Granted Nov 26, 2013·0 cites·6 claims
- 1147US8183697B2Apparatus and methods of forming an interconnect between a workpiece and substrateSUPRIYA LAKSHMI·Filed 2010·Granted May 22, 2012·0 cites·19 claims
- 1247US2008311738A1Method of forming an interconnect jointSUPRIYA LAKSHMI·Filed 2007·Application pending·0 cites
- 1346US8124517B2Method of forming an interconnect jointSUPRIYA LAKSHMI·Filed 2010·Granted Feb 28, 2012·0 cites·6 claims
- 1446US2008160177A1Methods for electroless plating of metal traces on a substrate and devices and systems thereofMATAYBAS J C·Filed 2006·Application pending·0 cites
- 1544US8173259B2Methods to fabricate functionally gradient materials and structures formed therebySUPRIYA LAKSHMI·Filed 2007·Granted May 8, 2012·0 cites·7 claims
- 1638US2011240349A1Multiple die structure and method of forming a connection between first and second dies in sameSUPRIYA LAKSHMI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →