Multiple die structure and method of forming a connection between first and second dies in same

Abstract

A multiple die structure includes a first die ( 110 ), a second die ( 120 ), a carbon nanotube ( 130 ) having a first end ( 131 ) in physical contact with the first die and having a second end ( 132 ) in physical contact with the second die, and an electrically conductive material ( 240 ) in physical contact with the first end of the carbon nanotube and in physical contact with the first die. Forming a connection between the first die and the second die can include providing a connection structure ( 400, 500, 600, 900 ) in which the electrically conductive material is adjacent to the carbon nanotube, placing the connection structure adjacent to the first die and to the second die, and bonding the first die and the second die to the connection structure.

1 . A multiple die structure comprising:
 a first die having an associated first connection structure;   a second die having an associated second connection structure;   a carbon nanotube having a first end adjacent to the first connection structure and having a second end adjacent to the second connection structure; and   an electrically conductive material in physical contact with the first end of the carbon nanotube and in physical contact with the first connection structure.   
     
     
         2 . The multiple die structure of  claim 1  wherein:
 the first connection structure comprises a first metal; and 
 the electrically conductive material also comprises the first metal. 
 
     
     
         3 . The multiple die structure of  claim 2  wherein:
 the first connection structure is a first copper pad and the second connection structure is a second copper pad; and 
 the electrically conductive material comprises copper. 
 
     
     
         4 . The multiple die structure of  claim 1  wherein:
 the electrically conductive material is in physical contact with the first end and the second end of the carbon nanotube and also in physical contact with the first connection structure and the second connection structure.