Inventor · disambiguated record
Lakshminarayan Viswanathan
Also filed as: VISWANATHAN LAKSHMINARAYAN
91 granted patents·6 pending applications·588 citations·filing 1998–2024
99Inventor score
Files withNXP USA INC50FREESCALE SEMICONDUCTOR INC23VISWANATHAN LAKSHMINARAYAN12MOTOROLA INC5SANCHEZ AUDEL A2
Top patents by PatentIndex Score
97 records- 0197US10269678B1Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereofNXP USA INC·Filed 2017·Granted Apr 23, 2019·31 cites·16 claims
- 0297US10199302B1Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2017·Granted Feb 5, 2019·15 cites·13 claims
- 0397US10199303B1Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2017·Granted Feb 5, 2019·14 cites·18 claims
- 0497US10141182B1Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereofNXP USA INC·Filed 2017·Granted Nov 27, 2018·21 cites·20 claims
- 0596US11128268B1Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereofNXP USA INC·Filed 2020·Granted Sep 21, 2021·10 cites·20 claims
- 0695US11621673B2Power amplifier packages and systems incorporating design-flexible package platformsNXP USA INC·Filed 2020·Granted Apr 4, 2023·4 cites·23 claims
- 0795US9362198B2Semiconductor devices with a thermally conductive layer and methods of their fabricationVISWANATHAN LAKSHMINARAYAN·Filed 2014·Granted Jun 7, 2016·22 cites·20 claims
- 0894US11749639B2Die-substrate assemblies having sinter-bonded backside via structures and associated fabrication methodsNXP USA INC·Filed 2021·Granted Sep 5, 2023·2 cites·20 claims
- 0994US11342275B2Leadless power amplifier packages including topside terminations and methods for the fabrication thereofNXP USA INC·Filed 2020·Granted May 24, 2022·4 cites·10 claims
- 1094US10440813B1Microelectronic modules including thermal extension levels and methods for the fabrication thereofNXP USA INC·Filed 2018·Granted Oct 8, 2019·8 cites·16 claims
- 1194US9922894B1Air cavity packages and methods for the production thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Mar 20, 2018·15 cites·14 claims
- 1292US12506446B2Power amplifier modules including topside cooling interfaces and methods for the fabrication thereofNXP USA INC·Filed 2024·Granted Dec 23, 2025·1 cites·12 claims
- 1392US10785862B2Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereofNXP USA INC·Filed 2018·Granted Sep 22, 2020·7 cites·20 claims
- 1492US10506704B1Electromagnetically-shielded microelectronic assemblies and methods for the fabrication thereofNXP USA INC·Filed 2018·Granted Dec 10, 2019·9 cites·20 claims
- 1592US10485091B2Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereofNXP USA INC·Filed 2018·Granted Nov 19, 2019·9 cites·20 claims
- 1692US9986646B2Packaged electronic devices with top terminations, and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted May 29, 2018·11 cites·10 claims
- 1792US9312231B2Method and apparatus for high temperature semiconductor device packages and structures using a low temperature processVISWANATHAN LAKSHMINARAYAN·Filed 2013·Granted Apr 12, 2016·10 cites·5 claims
- 1892US7445967B2Method of packaging a semiconductor die and package thereofFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Nov 4, 2008·23 cites·20 claims
- 1992US7429790B2Semiconductor structure and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Sep 30, 2008·33 cites·27 claims
- 2091US11830842B2Hybrid device assemblies and method of fabricationNXP USA INC·Filed 2020·Granted Nov 28, 2023·2 cites·20 claims
- 2191US9099567B2Packaged semiconductor devices and methods of their fabricationVISWANATHAN LAKSHMINARAYAN·Filed 2013·Granted Aug 4, 2015·13 cites·25 claims
- 2290US11984429B2Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereofNXP USA INC·Filed 2021·Granted May 14, 2024·2 cites·20 claims
- 2390US9673162B2High power semiconductor package subsystemsVISWANATHAN LAKSHMINARAYAN·Filed 2012·Granted Jun 6, 2017·11 cites·10 claims
- 2489US8803302B2System, method and apparatus for leadless surface mounted semiconductor packageVISWANATHAN LAKSHMINARAYAN·Filed 2012·Granted Aug 12, 2014·9 cites·19 claims
- 2588US11990872B2Power amplifier modules including topside cooling interfaces and methods for the fabrication thereofNXP USA INC·Filed 2020·Granted May 21, 2024·2 cites·13 claims
- 2688US9941210B1Semiconductor devices with protruding conductive vias and methods of making such devicesNXP USA INC·Filed 2016·Granted Apr 10, 2018·7 cites·26 claims
- 2787US8698291B2Packaged leadless semiconductor deviceSANCHEZ AUDEL A·Filed 2011·Granted Apr 15, 2014·10 cites·20 claims
- 2887US7446411B2Semiconductor structure and method of assemblyFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Nov 4, 2008·20 cites·27 claims
- 2986US9538659B2Solder wettable flanges and devices and systems incorporating solder wettable flangesVISWANATHAN LAKSHMINARAYAN·Filed 2013·Granted Jan 3, 2017·6 cites·20 claims
- 3085US12040291B2Radio frequency packages containing multilevel power substrates and associated fabrication methodsNXP USA INC·Filed 2021·Granted Jul 16, 2024·1 cites·20 claims
- 3184US2024404914A1Thick-silver layer interfaceNXP USA INC·Filed 2024·Application pending·0 cites
- 3283US11621228B2Substrate with thermal vias and sinter-bonded thermal dissipation structureNXP USA INC·Filed 2020·Granted Apr 4, 2023·1 cites·11 claims
- 3383US6261868B1Semiconductor component and method for manufacturing the semiconductor componentMOTOROLA INC·Filed 1999·Granted Jul 17, 2001·70 cites·14 claims
- 3482US12184237B2Surface-mount amplifier devicesNXP USA INC·Filed 2021·Granted Dec 31, 2024·1 cites·20 claims
- 3581US11343919B2Packaged electronic devices with top terminationsNXP USA INC·Filed 2019·Granted May 24, 2022·2 cites·11 claims
- 3681US9837328B2Semiconductor device packagesFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Dec 5, 2017·2 cites·17 claims
- 3781US9589860B2Electronic devices with semiconductor die coupled to a thermally conductive substrateVISWANATHAN LAKSHMINARAYAN·Filed 2014·Granted Mar 7, 2017·4 cites·34 claims
- 3881US9281283B2Semiconductor devices with impedance matching-circuitsVISWANATHAN LAKSHMINARAYAN·Filed 2012·Granted Mar 8, 2016·5 cites·16 claims
- 3980US10405417B2Packaged microelectronic component mounting using sinter attachmentNXP USA INC·Filed 2017·Granted Sep 3, 2019·2 cites·15 claims
- 4080US10375833B2Methods of manufacturing packaged electronic devices with top terminationsNXP USA INC·Filed 2018·Granted Aug 6, 2019·2 cites·22 claims
- 4179US10741446B2Method of wafer dicing for wafers with backside metallization and packaged diesNXP USA INC·Filed 2017·Granted Aug 11, 2020·2 cites·20 claims
- 4279US6072211ASemiconductor packageMOTOROLA INC·Filed 1998·Granted Jun 6, 2000·65 cites·14 claims
- 4378US10861764B2Microelectronic components having integrated heat dissipation posts and systems including the sameNXP USA INC·Filed 2019·Granted Dec 8, 2020·2 cites·20 claims
- 4477US12015004B2Hybrid device assemblies and method of fabricationNXP USA INC·Filed 2023·Granted Jun 18, 2024·0 cites·32 claims
- 4577US10104759B2Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereofNXP USA INC·Filed 2016·Granted Oct 16, 2018·2 cites·20 claims
- 4676US12506084B2Methods of fabricating substrates with thermal vias and sinter-bonded thermal dissipation structuresNXP USA INC·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 4776US10529638B2Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2018·Granted Jan 7, 2020·1 cites·20 claims
- 4876US10396006B2Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2018·Granted Aug 27, 2019·1 cites·20 claims
- 4976US9799580B2Semiconductor device package and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Oct 24, 2017·2 cites·17 claims
- 5076US9300254B2Radio frequency devices with surface-mountable capacitors for decoupling and methods thereofFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Mar 29, 2016·3 cites·17 claims
Showing the top 50 of 97 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →