Inventor · disambiguated record
Leon Barstad
Also filed as: BARSTAD LEON · BARSTAD LEON R
13 granted patents·12 pending applications·295 citations·filing 1999–2016
92Inventor score
Top patents by PatentIndex Score
25 records- 0193US6444110B2Electrolytic copper plating methodSHIPLEY CO LLC·Filed 1999·Granted Sep 3, 2002·86 cites·46 claims
- 0292US6911068B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted Jun 28, 2005·35 cites·23 claims
- 0390US6827839B2Plating bath analysisSHIPLEY CO LLC·Filed 2001·Granted Dec 7, 2004·33 cites·8 claims
- 0490US6773573B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted Aug 10, 2004·31 cites·17 claims
- 0590US6736954B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted May 18, 2004·27 cites·31 claims
- 0685US6531046B2Seed layer repair methodSHIPLEY CO LLC·Filed 2000·Granted Mar 11, 2003·44 cites·20 claims
- 0783US9598787B2Method of filling through-holesROHM & HAAS ELECT MAT·Filed 2013·Granted Mar 21, 2017·3 cites·7 claims
- 0883US6652731B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted Nov 25, 2003·28 cites·15 claims
- 0971US10508357B2Method of filling through-holes to reduce voids and other defectsROHM & HAAS ELECT MAT·Filed 2016·Granted Dec 17, 2019·2 cites·5 claims
- 1062US7384535B2Bath analysisROHM & HAAS ELECT MAT·Filed 2004·Granted Jun 10, 2008·6 cites·8 claims
- 1156US2006081475A1Reverse pulse plating composition and methodSHIPLEY CO LLC·Filed 2005·Application pending·0 cites
- 1254US2005139118A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2004·Application pending·0 cites
- 1350US2004074778A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 1449US2005155866A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 1549US2006065537A1Electrolytic copper plating solutionsBARSTAD LEON R·Filed 2005·Application pending·0 cites
- 1647US2005016858A1Reverse pulse plating composition and methodSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 1745US2014262801A1Method of filling through-holesROHM & HAAS ELECT MAT·Filed 2013·Application pending·0 cites
- 1844US10512174B2Method of filling through-holes to reduce voids and other defectsROHM & HAAS ELECT MAT·Filed 2016·Granted Dec 17, 2019·0 cites·8 claims
- 1943US10154598B2Filling through-holesROHM & HAAS ELECT MAT·Filed 2015·Granted Dec 11, 2018·0 cites·6 claims
- 2043US2006151327A1Analysis methodROHM & HAAS ELECT MAT·Filed 2004·Application pending·0 cites
- 2142US2004104124A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 2241US2003066756A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 2340US2006183328A1Electrolytic copper plating solutionsBARSTAD LEON R·Filed 2005·Application pending·0 cites
- 2440US2003010646A1Electrolytic copper plating solutionsFiled 2002·Application pending·0 cites
- 2532US9365943B2Method of electroplating uniform copper layersNAJJAR ELIE H·Filed 2011·Granted Jun 14, 2016·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →