Inventor · disambiguated record
Lee Han Meng@ Eugene Lee
Also filed as: EUGENE LEE LEE HAN MENG
17 granted patents·3 pending applications·30 citations·filing 2013–2020
90Inventor score
Files withTEXAS INSTRUMENTS INC20
Top patents by PatentIndex Score
20 records- 0190US9515009B2Packaged semiconductor device having leadframe features preventing delaminationTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 6, 2016·7 cites·6 claims
- 0287US9324640B1Triple stack semiconductor packageTEXAS INSTRUMENTS INC·Filed 2014·Granted Apr 26, 2016·8 cites·7 claims
- 0385US9184119B2Lead frame with abutment surfaceTEXAS INSTRUMENTS INC·Filed 2015·Granted Nov 10, 2015·5 cites·9 claims
- 0483US9691748B2Forming a panel of triple stack semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2016·Granted Jun 27, 2017·4 cites·10 claims
- 0578US11056462B2Locking dual leadframe for flip chip on leadframe packagesTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 6, 2021·2 cites·20 claims
- 0670US11742263B2Flippable leadframe for packaged electronic system having vertically stacked chip and componentsTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 29, 2023·0 cites·21 claims
- 0769US9892936B2Packaged semiconductor device having leadframe features preventing delaminationTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 13, 2018·1 cites·5 claims
- 0867US9496206B2Flippable leadframe for packaged electronic system having vertically stacked chips and componentsTEXAS INSTRUMENTS INC·Filed 2015·Granted Nov 15, 2016·1 cites·6 claims
- 0963US9859197B2Integrated circuit package fabricationTEXAS INSTRUMENTS INC·Filed 2015·Granted Jan 2, 2018·1 cites·10 claims
- 1056US10879154B2Flippable leadframe for packaged electronic system having vertically stacked chips and componentsTEXAS INSTRUMENTS INC·Filed 2016·Granted Dec 29, 2020·0 cites·11 claims
- 1156US10515928B2Stacked semiconductor system having interposer of half-etched and molded sheet metalTEXAS INSTRUMENTS INC·Filed 2014·Granted Dec 24, 2019·1 cites·8 claims
- 1255US10541225B2Methods of assembling a flip chip on a locking dual leadframeTEXAS INSTRUMENTS INC·Filed 2017·Granted Jan 21, 2020·0 cites·16 claims
- 1354US2015108626A1Multilevel LeadframeTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 1453US10804114B2Methods for making a multilevel leadframe by etching a conductive sheet from two opposite sidesTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 13, 2020·0 cites·15 claims
- 1552US10720406B2Stacked semiconductor system having interposer of half-etched and molded sheet metalTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 21, 2020·0 cites·16 claims
- 1651US2015060123A1Locking dual leadframe for flip chip on leadframe packagesTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 1751US2014346656A1Multilevel LeadframeTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 1848US9275983B2Integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2015·Granted Mar 1, 2016·0 cites·9 claims
- 1946US9842807B2Integrated circuit assemblyTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 12, 2017·0 cites·20 claims
- 2042US11348806B2Making a flat no-lead package with exposed electroplated side lead surfacesTEXAS INSTRUMENTS INC·Filed 2014·Granted May 31, 2022·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →