Inventor · disambiguated record
Leo M. Higgins, Iii
Also filed as: HIGGINS III LEO M · HIGGINS III LEO MICHAEL · HIGGINS LEO · HIGGINS LEO M
61 granted patents·4 pending applications·3,956 citations·filing 1983–2018
99Inventor score
Files withMOTOROLA INC20HIGGINS III LEO M13FREESCALE SEMICONDUCTOR INC9NXP USA INC4PRIME COMPUTER INC4
Top patents by PatentIndex Score
65 records- 0199US5639989AShielded electronic component assembly and method for making the sameMOTOROLA INC·Filed 1994·Granted Jun 17, 1997·657 cites·27 claims
- 0297US9508622B2Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosionHIGGINS III LEO M·Filed 2011·Granted Nov 29, 2016·40 cites·20 claims
- 0397US9012263B1Method for treating a bond pad of a package substrateMATHEW VARUGHESE·Filed 2013·Granted Apr 21, 2015·42 cites·20 claims
- 0497US7358119B2Thin array plastic package without die attach pad and process for fabricating the sameASAT LTD·Filed 2005·Granted Apr 15, 2008·78 cites·24 claims
- 0597US7348663B1Integrated circuit package and method for fabricating sameASAT LTD·Filed 2005·Granted Mar 25, 2008·135 cites·9 claims
- 0697US7344920B1Integrated circuit package and method for fabricating sameASAT LTD·Filed 2007·Granted Mar 18, 2008·89 cites·9 claims
- 0797US5468995ASemiconductor device having compliant columnar electrical connectionsMOTOROLA INC·Filed 1994·Granted Nov 21, 1995·259 cites·13 claims
- 0897US5291062AArea array semiconductor device having a lid with functional contactsMOTOROLA INC·Filed 1993·Granted Mar 1, 1994·301 cites·21 claims
- 0996US5710071AProcess for underfilling a flip-chip semiconductor deviceMOTOROLA INC·Filed 1995·Granted Jan 20, 1998·396 cites·17 claims
- 1096US5583377APad array semiconductor device having a heat sink with die receiving cavityMOTOROLA INC·Filed 1995·Granted Dec 10, 1996·245 cites·13 claims
- 1195US9219028B1Die-to-die inductive communication devices and methodsFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Dec 22, 2015·27 cites·21 claims
- 1295US6064114ASemiconductor device having a sub-chip-scale package structure and method for forming sameMOTOROLA INC·Filed 1997·Granted May 16, 2000·174 cites·20 claims
- 1394US9935079B1Laser sintered interconnections between dieNXP USA INC·Filed 2016·Granted Apr 3, 2018·16 cites·13 claims
- 1494US4967314ACircuit board constructionPRIME COMPUTER INC·Filed 1989·Granted Oct 30, 1990·90 cites·8 claims
- 1593US9461009B1Method and apparatus for assembling a semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Oct 4, 2016·10 cites·20 claims
- 1693US9093383B1Encapsulant for a semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jul 28, 2015·7 cites·20 claims
- 1793US5492863AMethod for forming conductive bumps on a semiconductor deviceMOTOROLA INC·Filed 1994·Granted Feb 20, 1996·149 cites·17 claims
- 1892US9470652B1Sensing field effect transistor devices and method of their manufactureFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Oct 18, 2016·9 cites·18 claims
- 1992US5117069ACircuit board fabricationPRIME COMPUTER INC·Filed 1990·Granted May 26, 1992·103 cites·8 claims
- 2092US4727410AHigh density integrated circuit packageCABOT TECHNICAL CERAMICS INC·Filed 1983·Granted Feb 23, 1988·104 cites·30 claims
- 2191US9287200B2Packaged semiconductor deviceHIGGINS III LEO M·Filed 2013·Granted Mar 15, 2016·13 cites·16 claims
- 2291US8921994B2Thermally enhanced package with lid heat spreaderHIGGINS III LEO M·Filed 2012·Granted Dec 30, 2014·11 cites·17 claims
- 2391US5378981AMethod for testing a semiconductor device on a universal test circuit substrateMOTOROLA INC·Filed 1993·Granted Jan 3, 1995·134 cites·18 claims
- 2490US6294405B1Method of forming semiconductor device having a sub-chip-scale package structureMOTOROLA INC·Filed 2000·Granted Sep 25, 2001·53 cites·23 claims
- 2589US5132780AHeat sink apparatus with an air deflection memberPRIME COMPUTER INC·Filed 1991·Granted Jul 21, 1992·110 cites·32 claims
- 2688US5985682AMethod for testing a bumped semiconductor dieMOTOROLA INC·Filed 1997·Granted Nov 16, 1999·71 cites·24 claims
- 2788US5212402ASemiconductor device with integral decoupling capacitorMOTOROLA INC·Filed 1992·Granted May 18, 1993·101 cites·17 claims
- 2887US9269648B2Thermally enhanced package with lid heat spreaderHIGGINS III LEO M·Filed 2014·Granted Feb 23, 2016·7 cites·20 claims
- 2987US5434452AZ-axis compliant mechanical IC wiring substrate and method for making the sameMOTOROLA INC·Filed 1994·Granted Jul 18, 1995·96 cites·15 claims
- 3085US5173764ASemiconductor device having a particular lid means and encapsulant to reduce die stressMOTOROLA INC·Filed 1991·Granted Dec 22, 1992·83 cites·16 claims
- 3183US8853867B2Encapsulant for a semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Oct 7, 2014·6 cites·20 claims
- 3281US8674509B2Integrated circuit die assembly with heat spreaderCARPENTER BURTON J·Filed 2012·Granted Mar 18, 2014·6 cites·16 claims
- 3379US6437283B1Device and method for processing substratesSIEMENS AG·Filed 2000·Granted Aug 20, 2002·29 cites·14 claims
- 3479US5343074ASemiconductor device having voltage distribution ring(s) and method for making the sameMOTOROLA INC·Filed 1993·Granted Aug 30, 1994·64 cites·27 claims
- 3578US10325876B2Surface finish for wirebondingMATHEW VARUGHESE·Filed 2014·Granted Jun 18, 2019·4 cites·10 claims
- 3677US10446476B2Packaged integrated circuit having stacked die and method for thereforNXP USA INC·Filed 2018·Granted Oct 15, 2019·3 cites·17 claims
- 3776US8754521B1Semiconductor device assembly having a heat spreaderCARPENTER BURTON J·Filed 2013·Granted Jun 17, 2014·4 cites·17 claims
- 3872US9059144B2Method for forming die assembly with heat spreaderHIGGINS III LEO M·Filed 2012·Granted Jun 16, 2015·3 cites·20 claims
- 3972US5583370ATab semiconductor device having die edge protection and method for making the sameMOTOROLA INC·Filed 1995·Granted Dec 10, 1996·49 cites·11 claims
- 4072US5029325ATAB tape translator for use with semiconductor devicesMOTOROLA INC·Filed 1990·Granted Jul 2, 1991·47 cites·19 claims
- 4170US8955388B2Mold compound compatibility test system and methods thereofMATHEW VARUGHESE·Filed 2012·Granted Feb 17, 2015·2 cites·20 claims
- 4270US8907485B2Copper ball bond features and structureHIGGINS III LEO M·Filed 2012·Granted Dec 9, 2014·2 cites·20 claims
- 4369US8946833B2Packaging for semiconductor sensor devices and methodsHIGGINS III LEO M·Filed 2012·Granted Feb 3, 2015·2 cites·16 claims
- 4469US5686352AMethod for making a tab semiconductor device with self-aligning cavity and intrinsic standoffMOTOROLA INC·Filed 1995·Granted Nov 11, 1997·38 cites·14 claims
- 4568US9111878B2Method for forming a semiconductor device assembly having a heat spreaderHIGGINS III LEO M·Filed 2013·Granted Aug 18, 2015·2 cites·19 claims
- 4665US9461012B2Copper ball bond features and structureFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Oct 4, 2016·1 cites·18 claims
- 4764US9685351B2Wire bond mold lock method and structureHIGGINS III LEO M·Filed 2014·Granted Jun 20, 2017·1 cites·9 claims
- 4863US5221858ATape automated bonding (TAB) semiconductor device with ground plane and method for making the sameMOTOROLA INC·Filed 1992·Granted Jun 22, 1993·33 cites·14 claims
- 4962US9324667B2Semiconductor devices with compliant interconnectsUEHLING TRENT S·Filed 2012·Granted Apr 26, 2016·2 cites·11 claims
- 5060US8970026B2Methods and structures for reducing stress on die assemblyLEAL GEORGE R·Filed 2013·Granted Mar 3, 2015·1 cites·20 claims
Showing the top 50 of 65 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →