Inventor · disambiguated record
Letian Huang
Also filed as: HUANG LETIAN
1 granted patent·6 pending applications·0 citations·filing 2021–2022
7Inventor score
Files with58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION6Yangtze Delta Reg Inst Huzhou Univ of Elect1
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7 records- 0143US11971446B2Interface system for interconnected die and MPU and communication method thereof58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Granted Apr 30, 2024·0 cites·8 claims
- 0230US2022276671A1The Clock Domain System of Interconnected Dies and Its Management Methods58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0330US2022276973A1Data transmission event used for interconnected dies58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0427US2022276306A1Communication method and its system between interconnected die and dsp/fpga58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0527US2022276982A1Interconnected Dies, Interconnected Microcomponents, Interconnected Microsystems and Their Communication Methods58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0626US2022276677A1An Inter-Die High-Speed Expansion System And An Expansion Method Thereof58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0724US2023269200A1On-chip network design method for distributed parallel operation algorithmYangtze Delta Reg Inst Huzhou Univ of Elect·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →