Inventor · disambiguated record
Lee-Lee Lau
Also filed as: LAU LEE-LEE
3 granted patents·1 pending application·11 citations·filing 2005–2011
62Inventor score
Top patents by PatentIndex Score
4 records- 0171US7004820B1CMP method and device capable of avoiding slurry residuesUNITED MICROELECTRONICS CORP·Filed 2005·Granted Feb 28, 2006·7 cites·5 claims
- 0263US8129278B2Chemical mechanical polishing processNEO BOON-TIONG·Filed 2005·Granted Mar 6, 2012·4 cites·46 claims
- 0343US8759218B2Chemical mechanical polishing processNEO BOON-TIONG·Filed 2011·Granted Jun 24, 2014·0 cites·16 claims
- 0440US2008242198A1Multi-step planarizing and polishing methodUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →