Inventor · disambiguated record
Lee Han Meng@Eugene Lee
Also filed as: LEE LEE H · LEE LEE HAN MENG@EUGENE
22 granted patents·9 pending applications·68 citations·filing 2007–2022
93Inventor score
Files withTEXAS INSTRUMENTS INC17LEE LEE HAN MENG@EUGENE7LI FELIX C2NAT SEMICONDUCTOR CORP2GEORGIA REGENTS UNIVERSITY1
Top patents by PatentIndex Score
31 records- 0194US9741643B2Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columnsTEXAS INSTRUMENTS INC·Filed 2016·Granted Aug 22, 2017·9 cites·7 claims
- 0291US11791170B2Universal semiconductor package moldsTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 17, 2023·2 cites·16 claims
- 0386US11264310B2Spring bar leadframe, method and packaged electronic device with zero draft angleTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 1, 2022·2 cites·16 claims
- 0485US8097934B1Delamination resistant device package having low moisture sensitivityLI FELIX C·Filed 2008·Granted Jan 17, 2012·16 cites·42 claims
- 0584US7838980B1TO263 device package having low moisture sensitivityNAT SEMICONDUCTOR CORP·Filed 2007·Granted Nov 23, 2010·14 cites·12 claims
- 0681US10115660B2Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columnsTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 30, 2018·2 cites·13 claims
- 0780US9013028B2Integrated circuit package and method of makingTEXAS INSTRUMENTS INC·Filed 2013·Granted Apr 21, 2015·5 cites·8 claims
- 0876US10784190B2Method of making leadframe stripTEXAS INSTRUMENTS INC·Filed 2017·Granted Sep 22, 2020·1 cites·19 claims
- 0971US11373940B2Method of making leadframe stripTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 28, 2022·0 cites·16 claims
- 1071US8884414B2Integrated circuit module with dual leadframeTEXAS INSTRUMENTS INC·Filed 2013·Granted Nov 11, 2014·4 cites·9 claims
- 1169US8203199B2Tie bar and mold cavity bar arrangements for multiple leadframe stack packageLEE LEE HAN MENG EUGENE·Filed 2009·Granted Jun 19, 2012·6 cites·18 claims
- 1265US8736042B2Delamination resistant device package having raised bond surface and mold locking apertureLI FELIX C·Filed 2011·Granted May 27, 2014·2 cites·15 claims
- 1363US12087674B2Spring bar leadframe, method and packaged electronic device with zero draft angleTEXAS INSTRUMENTS INC·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 1461US2015025132A1Compositions and methods for inhibiting endospores using green tea polyphenolsGEORGIA REGENTS UNIVERSITY·Filed 2014·Application pending·0 cites
- 1559US8779566B2Flexible routing for high current module applicationLEE LEE HAN MENG EUGENE·Filed 2011·Granted Jul 15, 2014·2 cites·10 claims
- 1658US8105063B1Three piece mold cavity design for packaging integrated circuitsLEE LEE HAN MENG EUGENE·Filed 2010·Granted Jan 31, 2012·1 cites·11 claims
- 1757US2020176365A1Integrated circuit package with lead lockTEXAS INSTRUMENTS INC·Filed 2020·Application pending·0 cites
- 1854US2020214290A1Compositions and Methods for Inhibiting Endospores Using Green Tea PolyphenolsUNIV RES INST INC AUGUSTA·Filed 2020·Application pending·0 cites
- 1952US8304887B2Module package with embedded substrate and leadframeLEE LEE HAN MENG EUGENE·Filed 2009·Granted Nov 6, 2012·1 cites·13 claims
- 2052US2021043466A1Universal semiconductor package moldsTEXAS INSTRUMENTS INC·Filed 2019·Application pending·0 cites
- 2151US11626350B2Cutting a leadframe assembly with a plurality of punching toolsTEXAS INSTRUMENTS INC·Filed 2020·Granted Apr 11, 2023·0 cites·9 claims
- 2249US2019206770A1Integrated circuit package with lead lockTEXAS INSTRUMENTS INC·Filed 2017·Application pending·0 cites
- 2347US9029194B2Making an integrated circuit module with dual leadframesTEXAS INSTRUMENTS INC·Filed 2014·Granted May 12, 2015·0 cites·11 claims
- 2447US2018122724A1Semiconductor Device Having Leadframe With Pressure-Absorbing Pad StrapsLEE LEE HAN MENG@EUGENE·Filed 2017·Application pending·0 cites
- 2545US8093707B2Leadframe packages having enhanced ground-bond reliabilityLEE SHAW WEI·Filed 2009·Granted Jan 10, 2012·1 cites·15 claims
- 2645US2011140253A1Dap ground bond enhancementNAT SEMICONDUCTOR CORP·Filed 2009·Application pending·0 cites
- 2744US11569152B2Electronic device with lead pitch gapTEXAS INSTRUMENTS INC·Filed 2019·Granted Jan 31, 2023·0 cites·19 claims
- 2843US10381293B2Integrated circuit package having an IC die between top and bottom leadframesTEXAS INSTRUMENTS INC·Filed 2016·Granted Aug 13, 2019·0 cites·19 claims
- 2933US2015144389A1Method of minimizing mold flash during dambar cutTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 3029US2013127029A1Two level leadframe with upset ball bonding surface and device packageLEE LEE HAN MENG EUGENE·Filed 2011·Application pending·0 cites
- 3124US8847370B2Exposed die package that helps protect the exposed die from damageLEE LEE HAN MENG EUGENE·Filed 2011·Granted Sep 30, 2014·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →