Inventor · disambiguated record
Lee Sun Lim
Also filed as: LIM LEE SUN
4 granted patents·1 pending application·37 citations·filing 2008–2023
70Inventor score
Top patents by PatentIndex Score
5 records- 0194US9252172B2Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity regionCHOW SENG GUAN·Filed 2011·Granted Feb 2, 2016·34 cites·18 claims
- 0264US9171769B2Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor packageCHOW SENG GUAN·Filed 2010·Granted Oct 27, 2015·2 cites·21 claims
- 0357US8110913B2Integrated circuit package system with integral inner lead and paddleDO BYUNG TAI·Filed 2008·Granted Feb 7, 2012·1 cites·20 claims
- 0455US9620557B2Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity regionSTATS CHIPPAC LTD·Filed 2015·Granted Apr 11, 2017·0 cites·20 claims
- 0553US2024395647A1Semiconductor Device and Method of Forming Channels in Encapsulant to Reduce Warpage in Reconstituted WaferSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →