Inventor · disambiguated record
Leeshawn Luo
Also filed as: LUO LEESHAWN
12 granted patents·3 pending applications·158 citations·filing 2002–2013
91Inventor score
Technology areasH10W
Top patents by PatentIndex Score
15 records- 0187US7208818B2Power semiconductor packageALPHA & OMEGA SEMICONDUCTOR·Filed 2004·Granted Apr 24, 2007·47 cites·15 claims
- 0284US6841852B2Integrated circuit package for semiconductor devices with improved electric resistance and inductanceFiled 2002·Granted Jan 11, 2005·37 cites·7 claims
- 0380US8169062B2Integrated circuit package for semiconductior devices with improved electric resistance and inductanceLUO LEESHAWN·Filed 2011·Granted May 1, 2012·6 cites·20 claims
- 0480US7183616B2High speed switching MOSFETS using multi-parallel die packages with/without special leadframesALPHA & OMEGA SEMICONDUCTOR·Filed 2002·Granted Feb 27, 2007·29 cites·22 claims
- 0577US8067822B2Integrated circuit package for semiconductor devices with improved electric resistance and inductanceLUO LEESHAWN·Filed 2008·Granted Nov 29, 2011·7 cites·8 claims
- 0673US9337132B2Methods and configuration for manufacturing flip chip contact (FCC) power packageSUN MING·Filed 2013·Granted May 10, 2016·3 cites·7 claims
- 0766US7633140B2Inverted J-lead for power devicesALPHA & OMEGA SEMICONDUCTOR·Filed 2003·Granted Dec 15, 2009·14 cites·26 claims
- 0865US7394151B2Semiconductor package with plated connectionALPHA & OMEGA SEMICONDUCTOR·Filed 2005·Granted Jul 1, 2008·3 cites·14 claims
- 0964US7391100B2Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding areaALPHA & OMEGA SEMICONDUCTOR·Filed 2004·Granted Jun 24, 2008·9 cites·2 claims
- 1062US7897438B2Method of making semiconductor package with plated connectionALPHA & OMEGA SEMICONDUCTOR·Filed 2008·Granted Mar 1, 2011·2 cites·18 claims
- 1159US8564049B2Flip chip contact (FCC) power packageSUN MING·Filed 2008·Granted Oct 22, 2013·1 cites·18 claims
- 1249US7951651B2Dual flat non-leaded semiconductor packageALPHA & OMEGA SEMICONDUCTOR·Filed 2009·Granted May 31, 2011·0 cites·20 claims
- 1340US2006145312A1Dual flat non-leaded semiconductor packageLIU KAI·Filed 2005·Application pending·0 cites
- 1439US2005280133A1Multiple device packageALPHA & OMEGA SEMICONDUCTOR·Filed 2004·Application pending·0 cites
- 1538US2006145319A1Flip chip contact (FCC) power packageSUN MING·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →