Inventor · disambiguated record
Lei Shan
Also filed as: SHAN LEI
14 granted patents·8 pending applications·22 citations·filing 2002–2024
86Inventor score
Top patents by PatentIndex Score
22 records- 0168US6992255B2Via and via landing structures for smoothing transitions in multi-layer substratesIBM·Filed 2003·Granted Jan 31, 2006·13 cites·21 claims
- 0266US9986633B2Embedding discrete components having variable dimensions in a substrateIBM·Filed 2016·Granted May 29, 2018·1 cites·12 claims
- 0364US9872392B2Power decoupling attachmentIBM·Filed 2016·Granted Jan 16, 2018·1 cites·14 claims
- 0460US2024374017A1Pannier backpackTHULE SWEDEN AB·Filed 2024·Application pending·0 cites
- 0558US10170249B2Multi-layer capacitor packageIBM·Filed 2018·Granted Jan 1, 2019·0 cites·1 claims
- 0656US12170252B2Electronic substrate stackingIBM·Filed 2021·Granted Dec 17, 2024·0 cites·14 claims
- 0756US10892105B2Multi-layer capacitor packageIBM·Filed 2017·Granted Jan 12, 2021·0 cites·7 claims
- 0855US2025109535A1Anti-static flash spinning composite non-woven fabric and preparation method thereofDAWNSENS NEW MAT XIAMEN CO LTD·Filed 2024·Application pending·0 cites
- 0955US2009295498A1Apparatus and method of via-stub resonance extinctionSHAN LEI·Filed 2009·Application pending·0 cites
- 1054US10701797B2Embedding discrete components having variable dimensions in a substrateIBM·Filed 2018·Granted Jun 30, 2020·0 cites·6 claims
- 1151US2025168971A1Trace width modulationAMPERE COMPUTING LLC·Filed 2023·Application pending·0 cites
- 1249US7537487B2Crosstalk reduction in dual inline memory module (DIMM) connectorsIBM·Filed 2008·Granted May 26, 2009·3 cites·1 claims
- 1349US7407415B2Crosstalk reduction in dual inline memory module (DIMM) connectorsIBM·Filed 2006·Granted Aug 5, 2008·3 cites·1 claims
- 1448US2007152771A1Apparatus and method of via-stub resonance extinctionSHAN LEI·Filed 2006·Application pending·0 cites
- 1547US11297717B2Power decoupling attachmentELPIS TECH INC·Filed 2017·Granted Apr 5, 2022·0 cites·6 claims
- 1647US11062976B2Functional stiffener that enables land grid array interconnections and power decouplingIBM·Filed 2019·Granted Jul 13, 2021·0 cites·17 claims
- 1744US2025217228A1Fault repair method and apparatus, electronic device and storage mediumZTE CORP·Filed 2022·Application pending·0 cites
- 1843US8257092B2Redundant clock channel for high reliability connectorsCHUN SUNGJUN·Filed 2010·Granted Sep 4, 2012·0 cites·20 claims
- 1943US6940165B2Impedance matched electrical interconnect using dielectric compoundsIBM·Filed 2002·Granted Sep 6, 2005·1 cites·18 claims
- 2031US2017162964A1Card edge connectorsIBM·Filed 2015·Application pending·0 cites
- 2129US2019048292A1Processing Composition of Improved Metal Interconnect Protection and The Use ThereofWU JIALI·Filed 2017·Application pending·0 cites
- 2227US10190031B2Thermally conductive interface composition and use thereofWU JIALI·Filed 2016·Granted Jan 29, 2019·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →