Inventor · disambiguated record
Leonard O. Turner
Also filed as: TURNER LEONARD · TURNER LEONARD O · TURNER LEONARD OTTIS
16 granted patents·1 pending application·386 citations·filing 1987–2002
94Inventor score
Files withINTEL CORP17
Top patents by PatentIndex Score
17 records- 0193US4798918AHigh density flexible circuitINTEL CORP·Filed 1987·Granted Jan 17, 1989·89 cites·15 claims
- 0292US5111362AEnclosure assembly with two identical covers having modifiable supports for asymmetrically housing a printed circuit board or the likeINTEL CORP·Filed 1990·Granted May 5, 1992·112 cites·10 claims
- 0379US6533613B1Shielded zero insertion force socketINTEL CORP·Filed 1999·Granted Mar 18, 2003·34 cites·5 claims
- 0464US6164999AZero insertion force socket and method for employing same to mount a processorINTEL CORP·Filed 1997·Granted Dec 26, 2000·22 cites·29 claims
- 0563US5418469AInterconnection device for connecting test equipment with a circuit board designed for fine pitch solder lead integrated circuit componentsINTEL CORP·Filed 1994·Granted May 23, 1995·21 cites·13 claims
- 0660US5057023AHigh density connector systemINTEL CORP·Filed 1990·Granted Oct 15, 1991·24 cites·16 claims
- 0753US5594356AInterconnection device for connecting test equipment with a circuit board designed for fine pitch solder lead integrated circuit componentsINTEL CORP·Filed 1995·Granted Jan 14, 1997·16 cites·8 claims
- 0848US6534860B2Thermal transfer plateINTEL CORP·Filed 1999·Granted Mar 18, 2003·12 cites·6 claims
- 0948US6506073B2Mounting bracket for integrated circuit deviceINTEL CORP·Filed 1999·Granted Jan 14, 2003·13 cites·16 claims
- 1047US7010858B2Method of fabricating a shielded zero insertion force socketINTEL CORP·Filed 2002·Granted Mar 14, 2006·4 cites·3 claims
- 1147US5603619AScalable test interface portINTEL CORP·Filed 1995·Granted Feb 18, 1997·13 cites·20 claims
- 1240US6322370B1High speed bus contact systemINTEL CORP·Filed 1998·Granted Nov 27, 2001·7 cites·16 claims
- 1340US6002591APrinted circuit board mounting assembly and a method for mounting an integrated circuit deviceINTEL CORP·Filed 1997·Granted Dec 14, 1999·8 cites·19 claims
- 1439US6503091B2High speed bus contact systemINTEL CORP·Filed 2001·Granted Jan 7, 2003·1 cites·15 claims
- 1538US2002070444A1Thermal transfer plateINTEL CORP·Filed 2001·Application pending·0 cites
- 1636US6183266B1Method and apparatus for transferring signals through a high density, low profile, array type stacking connectorINTEL CORP·Filed 1998·Granted Feb 6, 2001·5 cites·27 claims
- 1729US6565369B1Board-stacking connectorINTEL CORP·Filed 1998·Granted May 20, 2003·5 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →