Thermal transfer plate

Abstract

A thermal transfer plate (TTP) includes a thermally conductive plate, at least one footpad and at least one reference protrusion. The footpad includes a spring zone and a standoff member. In an implementation, the reference protrusion contacts a top surface of a substrate. In another implementation, the reference protrusion contacts a top surface of an integrated circuit. Both implementations permit the thickness of the gap between the integrated circuit and the TTP to be optimized for efficient transfer of heat from an integrated circuit.

What is claimed is:  
     
         1 . A thermal transfer plate, comprising: 
 a thermally conductive plate having a top side and a bottom side;    at least one footpad connected to the plate and including a spring zone and a standoff member; and    at least one reference protrusion.    
     
     
         2 . The thermal transfer plate of  claim 1  further comprising a reference protrusion positioned to contact a top surface of a substrate.  
     
     
         3 . The thermal transfer plate of  claim 1  further comprising a die cavity in the bottom side of the plate.  
     
     
         4 . The thermal transfer plate of  claim 3  further comprising a reference protrusion positioned in the die cavity.  
     
     
         5 . The thermal transfer plate of  claim 1  further comprising a thermal hardware mounting point on the footpad.  
     
     
         6 . The thermal transfer plate of  claim 1  further comprising four footpads connected to the plate in a substantially square arrangement.  
     
     
         7 . The thermal transfer plate of  claim 1  further comprising a spring zone formed in the plane of the plate.  
     
     
         8 . A method for coupling a thermal transfer plate to an integrated circuit package, comprising: 
 depressing plate foot pads having spring zones to bend towards a module substrate; and    inserting standoff members of the foot pads into mounting locations in the module substrate.    
     
     
         9 . The method of  claim 8 , further comprising 
 permanently securing the standoff members to a module substrate.    
     
     
         10 . The method of  claim 8 , further comprising aligning reference protrusions of the plate with the integrated circuit package before depressing the footpads.  
     
     
         11 . The method of  claim 8 , further comprising aligning a die cavity with an integrated circuit of the integrated circuit package before depressing the foot pads.  
     
     
         12 . The method of  claim 11 , further comprising depositing a thermal conducting material on the top surface of the integrated circuit before aligning the die cavity.  
     
     
         13 . The method of  claim 8 , further comprising connecting thermal management hardware to mounting points on the footpads.  
     
     
         14 . An assembly, comprising: 
 a module substrate;    an array substrate including an integrated circuit; and    a thermal transfer plate connected to the module substrate, the thermal transfer plate including a thermally conductive plate having a top side and a bottom side, at least one footpad that includes a spring zone and a standoff member, and at least one reference protrusion.    
     
     
         15 . The assembly of  claim 14  further comprising a reference protrusion of the thermal transfer plate positioned to contact a top surface of the array substrate.  
     
     
         16 . The assembly of  claim 14  further comprising a reference protrusion of the thermal transfer plate positioned to contact a top surface of the integrated circuit.  
     
     
         17 . The assembly of  claim 14  further comprising a die cavity in the bottom side of the plate.  
     
     
         18 . The assembly of  claim 14  further comprising a thermal hardware mounting point on the footpad.  
     
     
         19 . The assembly of  claim 14  further comprising four footpads arranged in a substantially square configuration.  
     
     
         20 . The assembly of  claim 14  wherein the spring zone is formed in the plane of the plate.