Inventor · disambiguated record
Liang-Yuh Chen
Also filed as: CHEN LIANG · CHEN LIANG-YUH
186 granted patents·109 pending applications·4,058 citations·filing 1989–2025
99Inventor score
Files withAPPLIED MATERIALS INC121YANGTZE MEMORY TECH CO LTD71EJOULE INC22CHEN LIANG-YUH12CORNELL RES FOUNDATION INC4
Top patents by PatentIndex Score
295 records- 0199US6848970B2Process control in electrochemically assisted planarizationAPPLIED MATERIALS INC·Filed 2002·Granted Feb 1, 2005·130 cites·20 claims
- 0298US6776693B2Method and apparatus for face-up substrate polishingAPPLIED MATERIALS INC·Filed 2002·Granted Aug 17, 2004·101 cites·46 claims
- 0398US6258223B1In-situ electroless copper seed layer enhancement in an electroplating systemAPPLIED MATERIALS INC·Filed 1999·Granted Jul 10, 2001·399 cites·9 claims
- 0496US11935596B2Three-dimensional memory devices having polysilicon layer and bonded semiconductor structures and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Mar 19, 2024·4 cites·20 claims
- 0596US7422516B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2007·Granted Sep 9, 2008·42 cites·18 claims
- 0696US7278911B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Oct 9, 2007·33 cites·18 claims
- 0796US6899804B2Electrolyte composition and treatment for electrolytic chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted May 31, 2005·77 cites·37 claims
- 0896US6811680B2Planarization of substrates using electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·102 cites·36 claims
- 0996US6773507B2Apparatus and method for fast-cycle atomic layer depositionAPPLIED MATERIALS INC·Filed 2002·Granted Aug 10, 2004·124 cites·39 claims
- 1096US6620670B2Process conditions and precursors for atomic layer deposition (ALD) of AL2O3APPLIED MATERIALS INC·Filed 2002·Granted Sep 16, 2003·217 cites·21 claims
- 1196US6436267B1Method for achieving copper fill of high aspect ratio interconnect featuresAPPLIED MATERIALS INC·Filed 2000·Granted Aug 20, 2002·105 cites·35 claims
- 1296US6107192AReactive preclean prior to metallization for sub-quarter micron applicationAPPLIED MATERIALS INC·Filed 1997·Granted Aug 22, 2000·212 cites·20 claims
- 1395US11929119B2Three-dimensional memory devices and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Mar 12, 2024·3 cites·18 claims
- 1495US10507446B2Method of preparing a material of a battery cellCHEN LIANG YUH·Filed 2017·Granted Dec 17, 2019·3 cites·20 claims
- 1595US10076737B2Method for preparing a material of a battery cellCHEN LIANG YUH·Filed 2013·Granted Sep 18, 2018·9 cites·23 claims
- 1695US8449950B2In-situ deposition of battery active lithium materials by plasma sprayingSHANG QUANYUAN·Filed 2010·Granted May 28, 2013·28 cites·11 claims
- 1795US6962524B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Nov 8, 2005·80 cites·32 claims
- 1895US5072288AMicrodynamic release structureCORNELL RES FOUNDATION INC·Filed 1989·Granted Dec 10, 1991·114 cites·23 claims
- 1995US2024367131A1Method of Preparing a Material of a Battery CellCHEN LIANG YUH·Filed 2024·Application pending·0 cites
- 2094US11302627B1On-chip capacitors in three-dimensional semiconductor devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Apr 12, 2022·3 cites·20 claims
- 2194US10576440B2Method of preparing a material of a battery cellCHEN LIANG YUH·Filed 2018·Granted Mar 3, 2020·3 cites·20 claims
- 2294US7427568B2Method of forming an interconnect structureAPPLIED MATERIALS INC·Filed 2006·Granted Sep 23, 2008·20 cites·9 claims
- 2394US7070475B2Process control in electrochemically assisted planarizationAPPLIED MATERIALS INC·Filed 2005·Granted Jul 4, 2006·9 cites·19 claims
- 2494US5989623ADual damascene metallizationAPPLIED MATERIALS INC·Filed 1997·Granted Nov 23, 1999·146 cites·26 claims
- 2593US11376559B2Processing system and method for producing a particulate materialEJOULE INC·Filed 2019·Granted Jul 5, 2022·5 cites·20 claims
- 2693US11059012B2Method of preparing a material of a battery cellCHEN LIANG YUH·Filed 2020·Granted Jul 13, 2021·2 cites·20 claims
- 2793US7993485B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Aug 9, 2011·24 cites·23 claims
- 2893US7285036B2Pad assembly for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Oct 23, 2007·18 cites·20 claims
- 2993US6979248B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2002·Granted Dec 27, 2005·42 cites·61 claims
- 3092US8420704B2Nano-structured polymer composites and process for preparing sameHILLMYER MARC·Filed 2008·Granted Apr 16, 2013·31 cites·26 claims
- 3192US6884724B2Method for dishing reduction and feature passivation in polishing processesAPPLIED MATERIALS INC·Filed 2001·Granted Apr 26, 2005·50 cites·31 claims
- 3292US6863797B2Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMPAPPLIED MATERIALS INC·Filed 2002·Granted Mar 8, 2005·45 cites·41 claims
- 3392US6841057B2Method and apparatus for substrate polishingAPPLIED MATERIALS INC·Filed 2002·Granted Jan 11, 2005·21 cites·38 claims
- 3492US6740221B2Method of forming copper interconnectsAPPLIED MATERIALS INC·Filed 2001·Granted May 25, 2004·56 cites·35 claims
- 3592US6207222B1Dual damascene metallizationAPPLIED MATERIALS INC·Filed 1999·Granted Mar 27, 2001·120 cites·6 claims
- 3691US12064757B2Method of preparing a material of a battery cellCHEN LIANG YUH·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 3791US11673112B2System and process with assisted gas flow inside a reaction chamberEJOULE INC·Filed 2020·Granted Jun 13, 2023·2 cites·8 claims
- 3891US7390744B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Jun 24, 2008·17 cites·14 claims
- 3991US7323416B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Jan 29, 2008·20 cites·20 claims
- 4091US6991528B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Jan 31, 2006·45 cites·27 claims
- 4191US6905965B2Reactive preclean prior to metallization for sub-quarter micron applicationAPPLIED MATERIALS INC·Filed 2004·Granted Jun 14, 2005·47 cites·20 claims
- 4291US6627542B1Continuous, non-agglomerated adhesion of a seed layer to a barrier layerAPPLIED MATERIALS INC·Filed 2000·Granted Sep 30, 2003·64 cites·42 claims
- 4391US6139697ALow temperature integrated via and trench fill process and apparatusAPPLIED MATERIALS INC·Filed 1997·Granted Oct 31, 2000·117 cites·18 claims
- 4491US5637539AVacuum microelectronic devices with multiple planar electrodesCORNELL RES FOUNDATION INC·Filed 1996·Granted Jun 10, 1997·75 cites·10 claims
- 4590US8216379B2Non-circular substrate holdersISHIKAWA TETSUYA·Filed 2009·Granted Jul 10, 2012·15 cites·23 claims
- 4690US7772121B2Method of forming a trench structureAPPLIED MATERIALS INC·Filed 2006·Granted Aug 10, 2010·12 cites·6 claims
- 4790US7137868B2Pad assembly for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2006·Granted Nov 21, 2006·12 cites·32 claims
- 4890US6988942B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2004·Granted Jan 24, 2006·41 cites·18 claims
- 4990US6458684B1Single step process for blanket-selective CVD aluminum depositionAPPLIED MATERIALS INC·Filed 2000·Granted Oct 1, 2002·42 cites·20 claims
- 5090US5770465ATrench-filling etch-masking microfabrication techniqueCORNELL RES FOUNDATION INC·Filed 1996·Granted Jun 23, 1998·73 cites·6 claims
Showing the top 50 of 295 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →