Inventor · disambiguated record
Liwei Cheng
Also filed as: CHENG LIWEI
8 granted patents·3 pending applications·2 citations·filing 2017–2023
73Inventor score
Top patents by PatentIndex Score
11 records- 0173US10741947B2Plated through hole socketing coupled to a solder ball to engage with a pinINTEL CORP·Filed 2018·Granted Aug 11, 2020·2 cites·23 claims
- 0270US12288744B2Microelectronic assemblies having conductive structures with different thicknesses on a core substrateINTEL CORP·Filed 2022·Granted Apr 29, 2025·0 cites·11 claims
- 0368US2023369192A1Dual trace thickness for single layer routingINTEL CORP·Filed 2023·Application pending·0 cites
- 0455US11380609B2Microelectronic assemblies having conductive structures with different thicknesses on a core substrateINTEL CORP·Filed 2018·Granted Jul 5, 2022·0 cites·20 claims
- 0555US2024332195A1Spray-coated photoresist and photoimageable dielectrics to enable tsv bridge for glass core packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0653US11769719B2Dual trace thickness for single layer routingINTEL CORP·Filed 2018·Granted Sep 26, 2023·0 cites·8 claims
- 0746US11705389B2Vias for package substratesINTEL CORP·Filed 2019·Granted Jul 18, 2023·0 cites·24 claims
- 0843US11849790B2Apparel fitting simulation based upon a captured two-dimensional human body posture imageCHENG LIWEI·Filed 2020·Granted Dec 26, 2023·0 cites·10 claims
- 0942US11393762B2Formation of tall metal pillars using multiple photoresist layersINTEL CORP·Filed 2017·Granted Jul 19, 2022·0 cites·19 claims
- 1041US2020411413A1Substrate for an electronic deviceALUR AMRUTHAVALLI PALLAVI·Filed 2019·Application pending·0 cites
- 1138US11120037B2Test data integration system and method thereofWISTRON CORP·Filed 2019·Granted Sep 14, 2021·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →