Inventor · disambiguated record
Li-Wei Feng
Also filed as: FENG LI · Feng li-wei
102 granted patents·23 pending applications·351 citations·filing 2000–2025
99Inventor score
Files withUNITED MICROELECTRONICS CORP88FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD26UNIV NEW YORK4CHONGQING ACADEMY OF ECO ENV SCIENCES1CHONGQING ACADEMY OF ECOLOGY AND ENV SCIENCES1
Top patents by PatentIndex Score
125 records- 0198US9530778B1Semiconductor devices having metal gate and method for manufacturing semiconductor devices having metal gateUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·40 cites·11 claims
- 0297US10074656B1Semiconductor memory device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 11, 2018·19 cites·10 claims
- 0397US9123659B1Method for manufacturing finFET deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Sep 1, 2015·30 cites·12 claims
- 0495US9859283B1Semiconductor memory structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 2, 2018·10 cites·18 claims
- 0595US9502410B1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·13 cites·8 claims
- 0694US11600622B2Method of forming semiconductor memory device comprises a bit line having a plurality of pins extending along a direction being perpendicular to a substrateFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Mar 7, 2023·2 cites·18 claims
- 0794US10605878B2System, method and computer-accessible medium for highly-accelerated dynamic magnetic resonance imaging using golden-angle radial sampling and compressed sensingUNIV NEW YORK·Filed 2018·Granted Mar 31, 2020·10 cites·20 claims
- 0894US9921285B2System, method and computer-accessible medium for highly-accelerated dynamic magnetic resonance imaging using golden-angle radial sampling and compressed sensingUNIV NEW YORK·Filed 2013·Granted Mar 20, 2018·19 cites·30 claims
- 0994US9704737B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jul 11, 2017·10 cites·6 claims
- 1094US9559164B2Nanowire transistor device and method for manufacturing nanowire transistor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 31, 2017·9 cites·10 claims
- 1194US9552978B1Method of decreasing fin bendingUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jan 24, 2017·11 cites·7 claims
- 1293US11380754B2Manufacturing method of semiconductor device and semiconductor deviceFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Jul 5, 2022·2 cites·14 claims
- 1393US10079277B2Method of fabricating metal-insulator-metal capacitorUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 18, 2018·9 cites·12 claims
- 1493US10068907B1Dynamic random access memoryUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 4, 2018·10 cites·15 claims
- 1593US9929162B1Semiconductor device and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Mar 27, 2018·9 cites·18 claims
- 1692US9960167B1Method for forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 1, 2018·7 cites·8 claims
- 1792US9484263B1Method of removing a hard mask on a gateUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 1, 2016·8 cites·16 claims
- 1891US11508614B2Method of forming semiconductor device having capped air gaps between buried bit lines and buried gateUNITED MICROELECTRONICS CORP·Filed 2020·Granted Nov 22, 2022·2 cites·10 claims
- 1991US10600790B2Manufacturing method of semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 24, 2020·6 cites·19 claims
- 2091US9455194B1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 27, 2016·7 cites·6 claims
- 2189US9627268B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 18, 2017·5 cites·5 claims
- 2288US10854676B2Semiconductor device having capped air caps between buried bit lines and buried gateUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 1, 2020·4 cites·9 claims
- 2388US9985035B1Semiconductor memory structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 29, 2018·4 cites·19 claims
- 2487US10978457B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 13, 2021·4 cites·9 claims
- 2587US10546861B2Semiconductor device for avoiding short circuit between adjacent storage nodes and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jan 28, 2020·4 cites·6 claims
- 2686US11951331B2Magnetic resonance signature matching (MRSIGMA) for real-time volumetric motion tracking and adaptive radiotherapyMEMORIAL SLOAN KETTERING CANCER CENTER·Filed 2020·Granted Apr 9, 2024·3 cites·20 claims
- 2786US10361209B2Semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 23, 2019·4 cites·6 claims
- 2885US9653290B2Method for manufacturing nanowire transistor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 16, 2017·3 cites·10 claims
- 2984US11049863B2Semiconductor structure with capacitor landing pad and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 29, 2021·3 cites·5 claims
- 3083US10181473B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 15, 2019·4 cites·11 claims
- 3183US9947792B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 17, 2018·3 cites·2 claims
- 3283US9754938B1Semiconductor device and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 5, 2017·3 cites·8 claims
- 3381US10169521B2Method for forming contact plug layoutUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 1, 2019·3 cites·19 claims
- 3481US9773887B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 26, 2017·3 cites·16 claims
- 3581US9508715B1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 29, 2016·3 cites·19 claims
- 3681US9384978B1Method of forming trenchesUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jul 5, 2016·3 cites·19 claims
- 3780US10056467B2Semiconductor fin structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 21, 2018·2 cites·9 claims
- 3880US9653603B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 16, 2017·2 cites·17 claims
- 3979US10672864B2Manufacturing method of semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jun 2, 2020·2 cites·9 claims
- 4079US10643997B2Semiconductor device with metal gatesUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 5, 2020·2 cites·5 claims
- 4178US12114487B2Semiconductor memory device having bit lines and isolation fins disposed on the substrateFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·19 claims
- 4278US11233057B2Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jan 25, 2022·2 cites·11 claims
- 4378US10396073B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 27, 2019·2 cites·5 claims
- 4478US10276650B2Semiconductor memory device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 30, 2019·2 cites·10 claims
- 4578US7325192B1Method of assembling content from content providersHEWLETT PACKARD DEVELOPMENT CO·Filed 2000·Granted Jan 29, 2008·33 cites·15 claims
- 4677US10170481B2Semiconductor memory device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 1, 2019·2 cites·16 claims
- 4776US11765881B2Semiconductor structure with capacitor landing pad and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 19, 2023·0 cites·8 claims
- 4876US10529719B2Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 7, 2020·2 cites·8 claims
- 4975US11271000B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 8, 2022·2 cites·9 claims
- 5075US10290736B2Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 14, 2019·2 cites·20 claims
Showing the top 50 of 125 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →