Inventor · disambiguated record
Lin Hou
Also filed as: HOU LIN · HOU LIN-JUN
26 granted patents·7 pending applications·39 citations·filing 2011–2024
93Inventor score
Files withSANDISK TECHNOLOGIES LLC11ORDOS YUANSHENG OPTOELECTRONICS CO LTD10BOE TECHNOLOGY GROUP CO LTD3INVENTEC PUDONG TECH CORP2CAO JINMING1
Top patents by PatentIndex Score
33 records- 0198US11562975B2Bonded assembly employing metal-semiconductor bonding and metal-metal bonding and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Jan 24, 2023·8 cites·20 claims
- 0298US11348901B1Interfacial tilt-resistant bonded assembly and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted May 31, 2022·8 cites·20 claims
- 0395US11869877B2Bonded assembly including inter-die via structures and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Jan 9, 2024·3 cites·19 claims
- 0494US11424215B2Bonded assembly formed by hybrid wafer bonding using selectively deposited metal linersSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Aug 23, 2022·3 cites·19 claims
- 0592US11948902B2Bonded assembly including an airgap containing bonding-level dielectric layer and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Apr 2, 2024·2 cites·20 claims
- 0691US11646283B2Bonded assembly containing low dielectric constant bonding dielectric materialSANDISK TECHNOLOGIES LLC·Filed 2021·Granted May 9, 2023·2 cites·10 claims
- 0790US12261227B2Thin film transistor, display substrate and display device with reduced leakage currentORDOS YUANSHENG OPTOELECTRONICS CO LTD·Filed 2021·Granted Mar 25, 2025·2 cites·18 claims
- 0874US10275978B2Coin-operated washer/dryerQINGDAO HAIER WASHING MACH CO·Filed 2016·Granted Apr 30, 2019·4 cites·11 claims
- 0970US11547943B2Providing social network content in gamesZYNGA INC·Filed 2017·Granted Jan 10, 2023·2 cites·16 claims
- 1070US10795228B2Array substrate with diffuse reflection layer, method for manufacturing the same, and display device comprising the sameBOE TECHNOLOGY GROUP CO LTD·Filed 2018·Granted Oct 6, 2020·1 cites·20 claims
- 1164US12443082B2Display substrate, display device and motherboardORDOS YUANSHENG OPTOELECTRONICS CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 1263US9844728B2Providing social network content in gamesCAO JINMING·Filed 2011·Granted Dec 19, 2017·3 cites·13 claims
- 1361US11637134B2Array substrate, method for manufacturing the same, and display deviceORDOS YUANSHENG OPTOELECTRONICS CO LTD·Filed 2021·Granted Apr 25, 2023·0 cites·10 claims
- 1459US12125814B2Bonded assembly containing different size opposing bonding pads and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Oct 22, 2024·0 cites·20 claims
- 1557US2025080192A1Method for estimating beam domain channel in spatial non-stationary massive mimo systemUNIV SOUTHEAST·Filed 2024·Application pending·0 cites
- 1655US12347804B2Bonded assembly including interconnect-level bonding pads and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Jul 1, 2025·0 cites·20 claims
- 1755US12026503B2Device of updating library required by testing program for testing and method thereofINVENTEC PUDONG TECH CORP·Filed 2022·Granted Jul 2, 2024·0 cites·8 claims
- 1855US11031419B2Array substrate, method for manufacturing the same, and display deviceORDOS YUANSHENG OPTOELECTRONICS CO LTD·Filed 2019·Granted Jun 8, 2021·0 cites·12 claims
- 1954US11791278B2Display substrate motherboard and manufacturing method thereof, display substrate and display apparatusORDOS YUANSHENG OPTOELECTRONICS CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·18 claims
- 2054US11646282B2Bonded semiconductor die assembly with metal alloy bonding pads and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted May 9, 2023·0 cites·20 claims
- 2151US8974188B2Blade clipHOU LIN-JUN·Filed 2012·Granted Mar 10, 2015·1 cites·20 claims
- 2250US11448929B2Array substrate with light shielding metal portions and manufacturing method thereof, display deviceORDOS YUANSHENG OPTOELECTRONICS CO LTD·Filed 2019·Granted Sep 20, 2022·0 cites·16 claims
- 2349US2021320075A1Bonded assembly containing bonding pads spaced apart by polymer material, and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Application pending·0 cites
- 2446US2022350196A1Color filter substrate and method for manufacturing same, display panel, and display deviceORDOS YUANSHENG OPTOELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 2545US2019165001A1Array substrate, method of manufacturing the same and display panelBOE TECHNOLOGY GROUP CO LTD·Filed 2018·Application pending·0 cites
- 2644US12412854B2Semiconductor devices containing copper bonding pads with different conductive barrier layers and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Sep 9, 2025·0 cites·3 claims
- 2742US11710747B2Array substrate, manufacturing method thereof, and display deviceORDOS YUANSHENG OPTOELECTRONICS CO LTD·Filed 2018·Granted Jul 25, 2023·0 cites·19 claims
- 2842US11362061B2Method for the electrical bonding of semiconductor componentsIMEC VZW·Filed 2020·Granted Jun 14, 2022·0 cites·22 claims
- 2942US2021217894A1Cmos thin film transistor, manufacturing method thereof and array substrateORDOS YUANSHENG OPTOELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 3041US11121226B2Thin film transistor and method for manufacturing the same, array substrate and display deviceORDOS YUANSHENG OPTOELECTRONICS CO LTD·Filed 2019·Granted Sep 14, 2021·0 cites·15 claims
- 3139US11398092B2Parking detection method and device based on visual differenceINTELLIGENT INTER CONNECTION TECH CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·10 claims
- 3239US2019244824A1Array substrate, method for fabricating the same, display panel and method for fabricating the sameBOE TECHNOLOGY GROUP CO LTD·Filed 2018·Application pending·0 cites
- 3338US2021157508A1Test method, system, medium and device for dual in-line memory moduleINVENTEC PUDONG TECH CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →