Inventor · disambiguated record
Lin-Chih Huang
Also filed as: HUANG LIN · HUANG LIN-CHIH
21 granted patents·1 pending application·82 citations·filing 2001–2020
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD14CHEN ZHEN2TAIWAN SEMICONDUCTOR MFG2CHEN HSIN-YU1HUANG LIN-CHIH1
Top patents by PatentIndex Score
22 records- 0197US9748190B2Low cost and ultra-thin chip on wafer on substrate (CoWoS) formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·25 cites·21 claims
- 0291US8324692B2Integrated inductorCHEN ZHEN·Filed 2010·Granted Dec 4, 2012·16 cites·12 claims
- 0387US9252110B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 2, 2016·6 cites·20 claims
- 0486US10290604B2Substrateless integrated circuit packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·4 cites·20 claims
- 0583US9006101B2Interconnect structure and methodCHEN HSIN-YU·Filed 2012·Granted Apr 14, 2015·6 cites·19 claims
- 0682US9842825B2Substrateless integrated circuit packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 12, 2017·5 cites·20 claims
- 0778US9112007B2Through via structure and methodLIN YUNG-CHI·Filed 2012·Granted Aug 18, 2015·3 cites·13 claims
- 0876US8395200B2Method and system for manufacturing copper-based capacitorCHEN ZHEN·Filed 2010·Granted Mar 12, 2013·5 cites·21 claims
- 0972US11728296B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·0 cites·20 claims
- 1071US11756883B2Through via structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 12, 2023·0 cites·20 claims
- 1170US9679859B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·1 cites·19 claims
- 1269US9831177B2Through via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 28, 2017·1 cites·20 claims
- 1362US6527431B2Combined mixing and injecting device for a moldTAIWAN FOOTWEAR RES INST·Filed 2001·Granted Mar 4, 2003·10 cites·10 claims
- 1461US10217687B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 26, 2019·0 cites·20 claims
- 1559US10714423B2Through via structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 14, 2020·0 cites·20 claims
- 1658US10811374B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 20, 2020·0 cites·20 claims
- 1758US9929069B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 27, 2018·0 cites·20 claims
- 1857US10157866B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·0 cites·20 claims
- 1955US9564345B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 7, 2017·0 cites·20 claims
- 2053US8951838B2Low cost and ultra-thin chip on wafer on substrate (CoWoS) formationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 10, 2015·0 cites·20 claims
- 2149US9953920B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 24, 2018·0 cites·20 claims
- 2238US2011316201A1Wafer Level Packaging Using Blade MoldingHUANG LIN-CHIH·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →