Inventor · disambiguated record
Li-Min Hung
Also filed as: HUNG LI-MIN
15 granted patents·52 citations·filing 2012–2022
91Inventor score
Top patents by PatentIndex Score
15 records- 0196US9643838B1Semiconductor device and package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 9, 2017·20 cites·20 claims
- 0295US9656260B2Method to produce chemical pattern in micro-fluidic structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 23, 2017·7 cites·7 claims
- 0394US10486153B2Method to produce chemical pattern in micro-fluidic structureILLUMINA INC·Filed 2017·Granted Nov 26, 2019·6 cites·20 claims
- 0492US9352315B2Method to produce chemical pattern in micro-fluidic structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 31, 2016·8 cites·20 claims
- 0588US11298697B2Method to produce chemical pattern in micro-fluidic structureILLUMINA INC·Filed 2019·Granted Apr 12, 2022·2 cites·12 claims
- 0685US10779100B2Method for manufacturing a microphoneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 15, 2020·3 cites·20 claims
- 0781US12303888B2Method to produce chemical pattern in micro-fluidic structureILLUMINA INC·Filed 2022·Granted May 20, 2025·0 cites·17 claims
- 0877US9998843B2Method for manufacturing a microphoneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·1 cites·7 claims
- 0972US9264833B2Structure and method for integrated microphoneTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·2 cites·20 claims
- 1068US11678133B2Structure for integrated microphoneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 13, 2023·0 cites·20 claims
- 1168US9269679B2Wafer level packaging techniquesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 23, 2016·2 cites·20 claims
- 1260US9673169B2Method and apparatus for a wafer seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 6, 2017·1 cites·20 claims
- 1352US9545691B2Method of removing waste of substrate and waste removing device thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 17, 2017·0 cites·21 claims
- 1443US8686571B2Bonding layer structure and method for wafer to wafer bondingHUANG HSIN-TING·Filed 2012·Granted Apr 1, 2014·0 cites·14 claims
- 1540US10273148B2Micro-electro-mechanical system and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 30, 2019·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →