Inventor · disambiguated record
Lingxin Jiang
Also filed as: JIANG LINGXIN
1 granted patent·2 pending applications·3 citations·filing 2022–2025
23Inventor score
Technology areasH10P
Files withTOKYO ELECTRON LTD3
Top patents by PatentIndex Score
3 records- 0193US12362215B2Apparatus for transferring substrate and method for transferring substrateTOKYO ELECTRON LTD·Filed 2022·Granted Jul 15, 2025·3 cites·16 claims
- 0274US2025308964A1Apparatus for Transferring Substrate and Method for Transferring SubstrateTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0354US2025174476A1Transfer Module, and Substrate Transfer Method in Semiconductor Manufacturing ApparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Lingxin Jiang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →