Inventor · disambiguated record
Lizabeth Keser
Also filed as: KESER LIZABETH · KESER LIZABETH A · KESER LIZABETH ANN · KESER LIZABETH ANN A
34 granted patents·23 pending applications·285 citations·filing 1999–2025
96Inventor score
Top patents by PatentIndex Score
57 records- 0197US7405102B2Methods and apparatus for thermal management in a multi-layer embedded chip structureFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jul 29, 2008·69 cites·12 claims
- 0291US9601472B2Package on package (POP) device comprising solder connections between integrated circuit device packagesQUALCOMM INC·Filed 2015·Granted Mar 21, 2017·9 cites·20 claims
- 0391US6458622B1Stress compensation composition and semiconductor component formed using the stress compensation compositionMOTOROLA INC·Filed 1999·Granted Oct 1, 2002·111 cites·8 claims
- 0489US9679873B2Low profile integrated circuit (IC) package comprising a plurality of diesQUALCOMM INC·Filed 2015·Granted Jun 13, 2017·6 cites·30 claims
- 0588US2025309017A1Fan out package with integrated peripheral devices and methodsINTEL CORP·Filed 2025·Application pending·0 cites
- 0686US6930032B2Under bump metallurgy structural design for high reliability bumped packagesFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Aug 16, 2005·43 cites·17 claims
- 0785US12362251B2Fan out package with integrated peripheral devices and methodsINTEL CORP·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0883US2024355697A1Package formation methods including coupling a molded routing layer to an integrated routing layerINTEL CORP·Filed 2024·Application pending·0 cites
- 0982US10546817B2Face-up fan-out electronic package with passive components using a supportINTEL IP CORP·Filed 2017·Granted Jan 28, 2020·2 cites·12 claims
- 1082US9985010B2System, apparatus, and method for embedding a device in a faceup workpieceQUALCOMM INC·Filed 2015·Granted May 29, 2018·4 cites·18 claims
- 1181US12057364B2Package formation methods including coupling a molded routing layer to an integrated routing layerINTEL CORP·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 1281US10665522B2Package including an integrated routing layer and a molded routing layerINTEL IP CORP·Filed 2017·Granted May 26, 2020·2 cites·13 claims
- 1380US9171782B2Stacked redistribution layers on dieQUALCOMM INC·Filed 2013·Granted Oct 27, 2015·6 cites·32 claims
- 1479US9379065B2Crack stopping structure in wafer level packaging (WLP)QUALCOMM INC·Filed 2013·Granted Jun 28, 2016·5 cites·24 claims
- 1578US11955395B2Fan out package with integrated peripheral devices and methodsINTEL CORP·Filed 2022·Granted Apr 9, 2024·0 cites·18 claims
- 1678US10163687B2System, apparatus, and method for embedding a 3D component with an interconnect structureQUALCOMM INC·Filed 2015·Granted Dec 25, 2018·3 cites·10 claims
- 1777US8217511B2Redistributed chip packaging with thermal contact to device backsideTRACHT NEIL T·Filed 2007·Granted Jul 10, 2012·7 cites·11 claims
- 1876US11581287B2Chip scale thin 3D die stacked packageINTEL CORP·Filed 2018·Granted Feb 14, 2023·2 cites·23 claims
- 1976US2025132259A1Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 2074US9142434B2Method for singulating electronic components from a substrateGAO WEI·Filed 2008·Granted Sep 22, 2015·4 cites·7 claims
- 2172US11404339B2Fan out package with integrated peripheral devices and methodsINTEL IP CORP·Filed 2020·Granted Aug 2, 2022·0 cites·18 claims
- 2271US11508637B2Fan out package and methodsINTEL CORP·Filed 2020·Granted Nov 22, 2022·0 cites·19 claims
- 2370US10403580B2Molded substrate package in fan-out wafer level packageINTEL IP CORP·Filed 2017·Granted Sep 3, 2019·1 cites·20 claims
- 2468US9209110B2Integrated device comprising wires as vias in an encapsulation layerQUALCOMM INC·Filed 2014·Granted Dec 8, 2015·2 cites·27 claims
- 2568US2022051990A1Face-up fan-out electronic package with passive components using a supportINTEL CORP·Filed 2021·Application pending·0 cites
- 2666US12211796B2Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 2766US11211337B2Face-up fan-out electronic package with passive components using a supportINTEL CORP·Filed 2019·Granted Dec 28, 2021·0 cites·20 claims
- 2866US10141202B2Semiconductor device comprising mold for top side and sidewall protectionQUALCOMM INC·Filed 2013·Granted Nov 27, 2018·2 cites·21 claims
- 2965US12243828B2Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2021·Granted Mar 4, 2025·0 cites·20 claims
- 3065US2025157941A1Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2025·Application pending·0 cites
- 3164US9806052B2Semiconductor package interconnectQUALCOMM INC·Filed 2015·Granted Oct 31, 2017·1 cites·24 claims
- 3264US9318405B2Wafer level package without sidewall crackingQUALCOMM INC·Filed 2015·Granted Apr 19, 2016·1 cites·20 claims
- 3361US2025391775A1Integrated circuit die stitching using jumper dieZERO ASIC CORP·Filed 2024·Application pending·0 cites
- 3460US10699980B2Fan out package with integrated peripheral devices and methodsINTEL IP CORP·Filed 2018·Granted Jun 30, 2020·0 cites·7 claims
- 3557US12476176B2Glass core substrate printed circuit board for warpage reductionINTEL CORP·Filed 2022·Granted Nov 18, 2025·0 cites·25 claims
- 3656US10720393B2Molded substrate package in fan-out wafer level packageINTEL IP CORP·Filed 2019·Granted Jul 21, 2020·0 cites·20 claims
- 3755US2025112191A1Direct die-two-die connection through an interposer without viasINTEL CORP·Filed 2023·Application pending·0 cites
- 3854US2025210428A1Stiffener assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 3952US12374625B2Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2021·Granted Jul 29, 2025·0 cites·7 claims
- 4052US7108755B2Simplification of ball attach method using super-saturated fine crystal fluxMOTOROLA INC·Filed 2002·Granted Sep 19, 2006·5 cites·36 claims
- 4149US2022415814A1Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2021·Application pending·0 cites
- 4248US2023317705A1Thin client form factor assemblyINTEL CORP·Filed 2022·Application pending·0 cites
- 4348US2023317681A1Three-dimensional stack cooling wingsINTEL CORP·Filed 2022·Application pending·0 cites
- 4448US2023317620A1Interposers for semiconductor devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 4548US2023317618A1Glass bridge for connecting diesINTEL CORP·Filed 2022·Application pending·0 cites
- 4648US2023317551A1Heterogeneous packages having thermal towersINTEL CORP·Filed 2022·Application pending·0 cites
- 4746US2023282615A1Stacked die packaging architecture with conductive vias on interposerINTEL CORP·Filed 2022·Application pending·0 cites
- 4844US2012252169A1Redistributed chip packaging with thermal contact to device backsideTRACHT NEIL T·Filed 2012·Application pending·0 cites
- 4944US2010148357A1Method of packaging integrated circuit dies with thermal dissipation capabilityFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 5043US2008182363A1Method for forming a microelectronic assembly including encapsulating a die using a sacrificial layerFREESCALE SEMICONDUCTOR INC·Filed 2007·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →