Inventor · disambiguated record
Lily Khor
Also filed as: KHOR LILY
9 granted patents·2 pending applications·423 citations·filing 2001–2019
88Inventor score
Top patents by PatentIndex Score
11 records- 0192US8071470B2Wafer level package using stud bump coated with solderKHOR LILY·Filed 2009·Granted Dec 6, 2011·135 cites·18 claims
- 0292US6482680B1Flip-chip on lead frameCARSEM SEMICONDUCTOR SDN BHD·Filed 2001·Granted Nov 19, 2002·247 cites·18 claims
- 0386US7273767B2Method of manufacturing a cavity packageCARSEM M SDN BHD·Filed 2005·Granted Sep 25, 2007·31 cites·24 claims
- 0466US9935039B2Pre-molded integrated circuit packagesCARSEM M SDN BHD·Filed 2014·Granted Apr 3, 2018·2 cites·10 claims
- 0565US11114367B2Molded integrated circuit packages and methods of forming the sameCARSEM M SDN BHD·Filed 2019·Granted Sep 7, 2021·1 cites·21 claims
- 0655US9640517B2Stacked electronic packagesCARSEM (M) SDN BHD·Filed 2014·Granted May 2, 2017·2 cites·20 claims
- 0753US9048397B2Color yield of white LEDsCARSEM M SDN BHD·Filed 2014·Granted Jun 2, 2015·1 cites·20 claims
- 0846US2018211902A1Pre-molded integrated circuit packagesCARSEM M SDN BHD·Filed 2018·Application pending·0 cites
- 0942US6953711B2Flip chip on lead frameCARSEM M SDN BHD·Filed 2003·Granted Oct 11, 2005·4 cites·22 claims
- 1041US2012043655A1Wafer-level package using stud bump coated with solderKHOR LILY·Filed 2011·Application pending·0 cites
- 1138US10468319B2Low-profile electronic packageCARSEM M SDN BHD·Filed 2017·Granted Nov 5, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →