Inventor · disambiguated record
Li-Chung Kuo
Also filed as: KUO LI-CHUNG
30 granted patents·4 pending applications·87 citations·filing 2005–2025
95Inventor score
Top patents by PatentIndex Score
34 records- 0196US10861799B1Dummy die placement without backside chippingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·12 cites·20 claims
- 0294US11075133B2Underfill structure for semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·7 cites·20 claims
- 0394US10840215B2Sawing underfill in packaging processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 17, 2020·9 cites·20 claims
- 0494US9620430B2Sawing underfill in packaging processesLU SZU WEI·Filed 2012·Granted Apr 11, 2017·23 cites·19 claims
- 0593US11164824B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 2, 2021·3 cites·20 claims
- 0688US11101260B2Method of forming a dummy die of an integrated circuit having an embedded annular structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·4 cites·20 claims
- 0788US8828848B2Die structure and method of fabrication thereofLIN JING-CHENG·Filed 2011·Granted Sep 9, 2014·10 cites·21 claims
- 0887US11024616B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 1, 2021·5 cites·20 claims
- 0987US2025357427A1Packages with multiple types of underfill and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1086US11637086B2Sawing underfill in packaging processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·1 cites·20 claims
- 1186US11621205B2Underfill structure for semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 4, 2023·1 cites·20 claims
- 1285US12294002B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 6, 2025·0 cites·20 claims
- 1384US11515267B2Dummy die placement without backside chippingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·1 cites·20 claims
- 1484US8963334B2Die-to-die gap control for semiconductor structure and methodLIN JING-CHENG·Filed 2011·Granted Feb 24, 2015·6 cites·20 claims
- 1581US2025233119A1Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1680US12080617B2Underfill structure for semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 1779US12469821B2Packages with multiple types of underfill and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 1878US11990429B2Dummy die placement without backside chippingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 1977US2025343088A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2074US11842936B2Underfill structure for semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 12, 2023·0 cites·20 claims
- 2173US12015023B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 2273US11631654B2Sawing underfill in packaging processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 18, 2023·0 cites·20 claims
- 2373US10157879B2Die-to-die gap control for semiconductor structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 18, 2018·2 cites·20 claims
- 2472US12021008B2Thermal interface materials, 3D semiconductor packages and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
- 2572US11699674B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 2672US11482465B2Thermal interface materials, 3D semiconductor packages and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 25, 2022·1 cites·20 claims
- 2772US11101236B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·1 cites·20 claims
- 2871US12087733B2Packages with multiple types of underfill and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 10, 2024·0 cites·19 claims
- 2966US12051668B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 3063US10879194B2Semiconductor device package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 29, 2020·1 cites·20 claims
- 3151US11201097B2Method of manufacture of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 14, 2021·0 cites·20 claims
- 3251US2024387546A1Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3348US11121050B2Method of manufacture of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 14, 2021·0 cites·20 claims
- 3447US7615603B2Hole or electron injection polymers and prepolymers, hole or electron transport polymers and prepolymers, method for forming the same, and their applicationUNIV NAT TAIWAN·Filed 2005·Granted Nov 10, 2009·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →