Inventor · disambiguated record
Li-Ling Liao
Also filed as: Liao li-ling
16 granted patents·28 pending applications·30 citations·filing 2011–2025
89Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD38IND TECH RES INST3DAI MING-JI1LIU CHUN-KAI1TAIWAN SEMICONDUCTOR MFG COPMPANY LTD1
Top patents by PatentIndex Score
44 records- 0196US12040267B2Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·2 cites·20 claims
- 0294US12261102B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 25, 2025·2 cites·16 claims
- 0391US11610835B2Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 21, 2023·2 cites·20 claims
- 0489US8609454B2Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devicesDAI MING-JI·Filed 2012·Granted Dec 17, 2013·20 cites·22 claims
- 0586US12014969B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·1 cites·20 claims
- 0685US12347764B2Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 0785US2025293143A1Organic interposer including intra-die structural reinforcement structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0881US2025364522A1Semiconductor package and methods of manufacturingTAIWAN SEMICONDUCTOR MFG COPMPANY LTD·Filed 2025·Application pending·0 cites
- 0980US2025364385A1Semiconductor package and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1080US2025070050A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1180US2025364426A1Method of manufacturing semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1280US2025357302A1Method for forming semiconductor package with variable pillar heightTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1379US2025349728A1Enhanced redistribution via structure for reliability improvement in semiconductor die packaging and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1479US2024387405A1Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1579US2025349786A1Microbump underfill fillet removal in semiconductor die packaging and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1679US2024387335A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1779US2025357370A1Stiffener structure with beveled sidewall for footprint reduction and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1879US2025349683A1Buffer block structures for c4 bonding and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1979US2025357371A1Two-piece type stiffener structure with beveled surface for delamination reduction and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2078US12113033B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 2178US2025336818A1Metal pillars preventing wetting on sidewalls and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2277US12176301B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 2377US2025343163A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2475US2025309139A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2574US2024297089A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2674US2025201686A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2772US11705406B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 2871US11728284B2Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 2970US12431415B2Buffer block structures for C4 bonding and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 3069US12482780B2Chip package structure including an underfill material portion comprising a cut regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 3169US12476203B2Stiffener structure with beveled sidewall for footprint reduction and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 3269US10288696B2Intelligent diagnosis system for power module and method thereofIND TECH RES INST·Filed 2016·Granted May 14, 2019·1 cites·18 claims
- 3366US11978722B2Structure and formation method of package containing chip structure with inclined sidewallsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 7, 2024·0 cites·20 claims
- 3465US8664509B2Thermoelectric apparatus and method of fabricating the sameLIU CHUN-KAI·Filed 2011·Granted Mar 4, 2014·2 cites·17 claims
- 3565US2023386988A1Semiconductor package with variable pillar height and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3665US2023395443A1Semiconductor package and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3765US2023378039A1Semiconductor package and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3865US2023395515A1Enhanced redistribution via structure for reliability improvement in semiconductor die packaging and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3965US2023395520A1Method of manufacturing semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4065US2023395492A1Metal Pillars Preventing Wetting on Sidewalls and Method Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4152US2023317671A1Substrate trench for controlling underfill fillet area and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4252US2016163950A1Structure of thermoelectric module and fabricating method thereofIND TECH RES INST·Filed 2014·Application pending·0 cites
- 4350US2023063295A1Package structure with stiffener ring having slant sidewallTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 4449US2018040798A1Structure of thermoelectric module and fabricating method thereofIND TECH RES INST·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →