Inventor · disambiguated record
Lilia May
Also filed as: MAY LILIA
10 granted patents·8 pending applications·6 citations·filing 2014–2024
81Inventor score
Top patents by PatentIndex Score
18 records- 0184US10685850B2High density organic interconnect structuresINTEL CORP·Filed 2016·Granted Jun 16, 2020·3 cites·11 claims
- 0284US2024355641A1High density organic interconnect structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 0380US12062551B2High density organic interconnect structuresINTEL CORP·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 0475US11631595B2High density organic interconnect structuresINTEL CORP·Filed 2021·Granted Apr 18, 2023·0 cites·11 claims
- 0571US11195727B2High density organic interconnect structuresINTEL CORP·Filed 2020·Granted Dec 7, 2021·0 cites·18 claims
- 0670US11107780B2Pseudo-stripline using double solder-resist structureINTEL CORP·Filed 2019·Granted Aug 31, 2021·1 cites·16 claims
- 0762US9613933B2Package structure to enhance yield of TMI interconnectionsDE BONIS THOMAS J·Filed 2014·Granted Apr 4, 2017·2 cites·20 claims
- 0862US2022183157A1Apparatus with embedded fine line space in a cavity, and a method for forming the sameINTEL CORP·Filed 2022·Application pending·0 cites
- 0958US2025112100A1Die embedded in glass layer with two-side connectivityINTEL CORP·Filed 2023·Application pending·0 cites
- 1057US2025293122A1Multi-die assemblies with glass support structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 1156US2025183180A1Direct bonding for embedded bridges with viasINTEL CORP·Filed 2023·Application pending·0 cites
- 1255US2024329333A1Co-packaging of photonic & electronic integrated circuit dieINTEL CORP·Filed 2023·Application pending·0 cites
- 1352US10049971B2Package structure to enhance yield of TMI interconnectionsINTEL CORP·Filed 2017·Granted Aug 14, 2018·0 cites·3 claims
- 1451US2024111090A1Directly coupled optical interposerINTEL CORP·Filed 2022·Application pending·0 cites
- 1550US11272619B2Apparatus with embedded fine line space in a cavity, and a method for forming the sameINTEL CORP·Filed 2016·Granted Mar 8, 2022·0 cites·11 claims
- 1646US11075130B2Package substrate having polymer-derived ceramic coreINTEL CORP·Filed 2017·Granted Jul 27, 2021·0 cites·20 claims
- 1745US10573622B2Methods of forming joint structures for surface mount packagesINTEL CORP·Filed 2017·Granted Feb 25, 2020·0 cites·8 claims
- 1841US2020176355A1Substrate embedded heat pipeINTEL CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →