Inventor · disambiguated record

Liu Ming-Tsung

Also filed as: MING-TSUNG LIU

2 granted patents·104 citations·filing 1995–1997

69Inventor score

Technology areasH10W

Files withUNITED MICROELECTRONICS CORP2

Top patents by PatentIndex Score

2 records

0182US5703408ABonding pad structure and method thereofUNITED MICROELECTRONICS CORP·Filed 1995·Granted Dec 30, 1997·73 cites·20 claims
0262US5834365AMethod of forming a bonding padUNITED MICROELECTRONICS CORP·Filed 1997·Granted Nov 10, 1998·31 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →