Inventor · disambiguated record
Li Sun
Also filed as: SUN LI · SUN LI-CHIEN
15 granted patents·12 pending applications·34 citations·filing 2008–2024
89Inventor score
Files withAVAGO TECH INT SALES PTE LID7AVAGO TECHNOLOGIES GENERAL IP7BOE TECHNOLOGY GROUP CO LTD4SUN LI3ADVANCED NEUROMODULATION SYSTEMS INC1
Top patents by PatentIndex Score
27 records- 0186US11723143B1Thermal dissipation and shielding improvement using merged PCB bottom copper postAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Aug 8, 2023·1 cites·20 claims
- 0284USD983984SWarm beltHANGZHOU YINGYI TECH CO LTD·Filed 2021·Granted Apr 18, 2023·12 cites·1 claims
- 0382USD1041022SNeck massagerSUN LI·Filed 2024·Granted Sep 3, 2024·6 cites·1 claims
- 0481US10364504B2Fabrication of multilayered nanosized porous membranes and their use for making novel nanostructuresSUN LI·Filed 2013·Granted Jul 30, 2019·2 cites·20 claims
- 0580US10827617B2Printed circuit board with cavityAVAGO TECH INT SALES PTE LID·Filed 2019·Granted Nov 3, 2020·3 cites·20 claims
- 0680US10134682B2Circuit package with segmented external shield to provide internal shielding between electronic componentsAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Nov 20, 2018·4 cites·15 claims
- 0777USD1047157SWarm beltSUN LI·Filed 2024·Granted Oct 15, 2024·4 cites·1 claims
- 0869US12113032B2Substrate having undercut portion for stress mitigationAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
- 0967US12156423B2Composite film and manufacturing method thereof, and encapsulation structure including the composite filmBOE TECHNOLOGY GROUP CO LTD·Filed 2020·Granted Nov 26, 2024·0 cites·3 claims
- 1064US2016036001A1Composite film and manufacturing method thereof, and encapsulation structure including the composite filmBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Application pending·0 cites
- 1160US9997428B2Via structures for thermal dissipationAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Jun 12, 2018·1 cites·40 claims
- 1260US9865479B2Method of attaching components to printed cirucuit board with reduced accumulated tolerancesAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Jan 9, 2018·1 cites·20 claims
- 1359US2025336789A1Posts having multiple widthsAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 1458US11276650B2Stress mitigation structureAVAGO TECH INT SALES PTE LID·Filed 2019·Granted Mar 15, 2022·0 cites·20 claims
- 1556US12137516B2Package with self shieldingAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Nov 5, 2024·0 cites·17 claims
- 1655US2021214835A1Mask sheet, mask component, and vapor-deposition methodHEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2019·Application pending·0 cites
- 1755US2024170384A1Double side molded land grid array package platform using a substrate with copper postsAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 1849US11724115B2System and method for reducing heat of an implantable medical device during wireless chargingADVANCED NEUROMODULATION SYSTEMS INC·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 1949US2009279272A1Soldering pad and circuit board utilizing the sameHON HAI PREC IND CO LTD·Filed 2008·Application pending·0 cites
- 2049US2019165330A1Evaporation equipmentBOE TECHNOLOGY GROUP CO LTD·Filed 2018·Application pending·0 cites
- 2146US2018159035A1Evaporation carrier plate and evaporation apparatusBOE TECHNOLOGY GROUP CO LTD·Filed 2017·Application pending·0 cites
- 2243US2019071747A1Method of heat treating steelGM GLOBAL TECH OPERATIONS LLC·Filed 2017·Application pending·0 cites
- 2343US2018371631A1Exposed segmented nanostructure arraysUNIV HOUSTON SYSTEM·Filed 2016·Application pending·0 cites
- 2437US9907169B1Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCBAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Feb 27, 2018·0 cites·22 claims
- 2533US2017117229A1Circuit package with trench features to provide internal shielding between electronic componentsAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
- 2632US2017018501A1Via structures for thermal dissipationAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
- 2732US2017118877A1Circuit package with bond wires to provide internal shielding between electronic componentsAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →