Inventor · disambiguated record
Li-Chuan Tsai
Also filed as: TSAI LI CHUAN
14 granted patents·2 pending applications·123 citations·filing 2010–2020
90Inventor score
Files withADVANCED SEMICONDUCTOR ENG16
Top patents by PatentIndex Score
16 records- 0197US9887167B1Embedded component package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Feb 6, 2018·54 cites·21 claims
- 0297US9549468B1Semiconductor substrate, semiconductor module and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jan 17, 2017·36 cites·20 claims
- 0391US9966333B2Semiconductor substrate, semiconductor module and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 8, 2018·6 cites·19 claims
- 0490US9754906B2Double plated conductive pillar package substrateADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Sep 5, 2017·7 cites·20 claims
- 0588US10446515B2Semiconductor substrate and semiconductor packaging device, and method for forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Oct 15, 2019·6 cites·18 claims
- 0683US9812387B2Semiconductor substrate, semiconductor module and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Nov 7, 2017·3 cites·24 claims
- 0780US9426891B2Circuit board with embedded passive component and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Aug 23, 2016·5 cites·20 claims
- 0876US10636730B2Semiconductor package and semiconductor manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Apr 28, 2020·2 cites·17 claims
- 0975US9984898B2Substrate, semiconductor package including the same, and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 29, 2018·2 cites·32 claims
- 1071US10515884B2Substrate having a conductive structure within photo-sensitive resinADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 24, 2019·2 cites·25 claims
- 1158US2020258826A1Semiconductor package and semiconductor manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 1251US10497659B2Double plated conductive pillar package substrateADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Dec 3, 2019·0 cites·12 claims
- 1344US11189610B2Substrate structure and manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Nov 30, 2021·0 cites·14 claims
- 1443US10748843B2Semiconductor substrate including embedded component and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Aug 18, 2020·0 cites·20 claims
- 1539US10381296B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Aug 13, 2019·0 cites·18 claims
- 1635US2011127654A1Semiconductor Package and Manufacturing Methods ThereofADVANCED SEMICONDUCTOR ENG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →