Inventor · disambiguated record
Liming Tsau
Also filed as: TSAU LIMING
22 granted patents·15 pending applications·243 citations·filing 1998–2025
95Inventor score
Files withAVAGO TECH INT SALES PTE LID20BROADCOM CORP13AVAGO TECHNOLOGIES GENERAL IP1NEWPORT FAB LLC1TSAU LIMING1
Top patents by PatentIndex Score
37 records- 0192US9741667B2Integrated circuit with die edge assurance structureAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Aug 22, 2017·10 cites·21 claims
- 0291US11906802B2Photonics integration in semiconductor packagesAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Feb 20, 2024·2 cites·20 claims
- 0390US7187015B2High-density metal capacitor using dual-damascene copper interconnectBROADCOM CORP·Filed 2005·Granted Mar 6, 2007·21 cites·32 claims
- 0489US7329955B2Metal-insulator-metal (MIM) capacitorBROADCOM CORP·Filed 2006·Granted Feb 12, 2008·17 cites·18 claims
- 0586US6417094B1Dual-damascene interconnect structures and methods of fabricating sameNEWPORT FAB LLC·Filed 1998·Granted Jul 9, 2002·94 cites·15 claims
- 0679US6833604B2High density metal capacitor using dual-damascene copper interconnectBROADCOM CORP·Filed 2001·Granted Dec 21, 2004·24 cites·15 claims
- 0775US6985387B2System and method for one-time programmed memory through direct-tunneling oxide breakdownBROADCOM CORP·Filed 2004·Granted Jan 10, 2006·18 cites·19 claims
- 0875US6960819B2System and method for one-time programmed memory through direct-tunneling oxide breakdownBROADCOM CORP·Filed 2000·Granted Nov 1, 2005·20 cites·20 claims
- 0974US2025096108A1Cantilevered power planes to provide a return current path for high-speed signalsAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 1073US2024151921A1Photonics Integration in Semiconductor PackagesAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 1171US2025279341A1Multilayer Cores, Variable Width Vias, and Offset ViasAVAGO TECH INT SALES PTE LID·Filed 2025·Application pending·0 cites
- 1270US6803306B2High density metal capacitor using via etch stopping layer as field dielectric in dual-damascence interconnect processBROADCOM CORP·Filed 2001·Granted Oct 12, 2004·15 cites·14 claims
- 1370US2024395689A1Integrated circuit package with serpentine conductor and method of makingAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 1466US12068232B2Integrated circuit package with serpentine conductor and method of makingAVAGO TECH INT SALES PTE LID·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
- 1564US12191243B2Cantilevered power planes to provide a return current path for high-speed signalsAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 1662US2023352383A1Multilayer Cores, Variable Width Vias, and Offset ViasAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 1760US12463319B2Integrated antennas on side wall of 3D stacked dieAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Nov 4, 2025·0 cites·8 claims
- 1859US11049829B2Redistribution metal and under bump metal interconnect structures and methodAVAGO TECH INT SALES PTE LID·Filed 2019·Granted Jun 29, 2021·0 cites·20 claims
- 1958US7009891B2System and method for one-time programmed memory through direct-tunneling oxide breakdownBROADCOM CORP·Filed 2005·Granted Mar 7, 2006·3 cites·20 claims
- 2058US6952053B2Metal bond pad for integrated circuits allowing improved probing ability of small padsBROADCOM CORP·Filed 2002·Granted Oct 4, 2005·8 cites·15 claims
- 2156US6902972B2High-density metal capacitor using dual-damascene copper interconnectBROADCOM CORP·Filed 2004·Granted Jun 7, 2005·6 cites·5 claims
- 2256US2025364474A1Barriers in seminconductor devicesAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 2353US2024145392A1Substrate with Differing Dielectric ConstantsAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 2452US10504862B2Redistribution metal and under bump metal interconnect structures and methodAVAGO TECH INT SALES PTE LID·Filed 2017·Granted Dec 10, 2019·0 cites·20 claims
- 2552US2024128156A1Microfluidic Channels for Cooling Hybrid Bonded InterfacesAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 2651US12216153B2Semiconductor product with edge integrity detection structureAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 2751US2024038641A1Elastomer Interconnection Substrate LayerAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 2851US2024038645A1Semiconductor Package Interconnection StructureAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 2951US2024038613A1Edge Seal for Bonded Stacks of Different Size Semiconductor DevicesAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 3050US2023369267A13D Packaging Heterogeneous Area Array InterconnectionsAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 3147US6950355B2System and method to screen defect related reliability failures in CMOS SRAMSBROADCOM CORP·Filed 2001·Granted Sep 27, 2005·4 cites·13 claims
- 3244US2006022225A1Metal bond pad for integrated circuits allowing improved probing ability of small padsBROADCOM CORP·Filed 2005·Application pending·0 cites
- 3343US7049204B2High density metal capacitor using via etch stopping layer as field dielectric in dual-damascence interconnect processBROADCOM CORP·Filed 2004·Granted May 23, 2006·1 cites·4 claims
- 3442US10629504B2Die edge crack and delamination detectionAVAGO TECH INT SALES PTE LID·Filed 2017·Granted Apr 21, 2020·0 cites·20 claims
- 3537US2008042221A1High voltage transistorTSAU LIMING·Filed 2006·Application pending·0 cites
- 3635US2003034489A1Apparatus and method for a production testline to monitor CMOS SRAMsBROADCOM CORP·Filed 2002·Application pending·0 cites
- 3730US8106476B2Semiconductor die with fuse window and a monitoring window over a structure which indicates fuse integrityWU ROBERT I·Filed 2007·Granted Jan 31, 2012·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →