Inventor · disambiguated record
Lin-Wei Wang
Also filed as: WANG LIN · WANG LIN-WEI
9 granted patents·1 pending application·20 citations·filing 2010–2021
82Inventor score
Files withHWANG CHIEN LING3TAIWAN SEMICONDUCTOR MFG2CHANGSHU INST TECH1ENN SCIENCE AND TECH DEV CO LTD1HSIAO YI-LI1
Top patents by PatentIndex Score
10 records- 0190US9735039B2Apparatus for separating wafer from carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 15, 2017·10 cites·20 claims
- 0286US11692628B2Sealing device for gas-liquid two-phase fluid medium under variable working conditionsCHANGSHU INST TECH·Filed 2021·Granted Jul 4, 2023·2 cites·7 claims
- 0369US9700950B2Innovative multi-purpose dipping plateJANG BOR-PING·Filed 2012·Granted Jul 11, 2017·2 cites·19 claims
- 0469US8940618B2Method and device for cutting semiconductor wafersHWANG CHIEN LING·Filed 2012·Granted Jan 27, 2015·2 cites·20 claims
- 0569US8616433B2Forming low stress joints using thermal compress bondingTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Dec 31, 2013·2 cites·13 claims
- 0662US8360303B2Forming low stress joints using thermal compress bondingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 29, 2013·1 cites·7 claims
- 0760US9434967B2Microbial culture medium and cultural methodENN SCIENCE AND TECH DEV CO LTD·Filed 2013·Granted Sep 6, 2016·1 cites·5 claims
- 0851US8834662B2Apparatus and method of separating wafer from carrierHWANG CHIEN LING·Filed 2012·Granted Sep 16, 2014·0 cites·20 claims
- 0943US8702871B2Package assembly cleaning process using vaporized solventHSIAO YI-LI·Filed 2011·Granted Apr 22, 2014·0 cites·17 claims
- 1040US2013273717A1Apparatus and Method for the Singulation of a Semiconductor WaferHWANG CHIEN LING·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →