Inventor · disambiguated record
Liop-Jin Yap
Also filed as: YAP LIOP-JIN
8 granted patents·132 citations·filing 1998–2003
88Inventor score
Files withST ASSEMBLY TEST SERVICES PTE4ST ASSEMBLY TEST SERVICE LTD1ST ASSEMBLY TEST SERVICES1ST ASSEMBLY TEST SERVICES LTD1ST ASSEMBY TEST SERVICES PTE L1
Top patents by PatentIndex Score
8 records- 0175US6586925B2Method and apparatus for establishing quick and reliable connection between a semiconductor device handler plate and a semiconductor device test head plateST ASSEMBLY TEST SERVICES LTD·Filed 2001·Granted Jul 1, 2003·28 cites·54 claims
- 0270US6242933B1Device probe socket forming part of a test head, interfacing between test head and a probe handler, used for device strip testingST ASSEMBLY TEST SERVICES·Filed 1999·Granted Jun 5, 2001·37 cites·15 claims
- 0369US6535004B2Testing of BGA and other CSP packages using probing techniquesST ASSEMBLY TEST SERVICE LTD·Filed 2002·Granted Mar 18, 2003·12 cites·14 claims
- 0461US6791346B2Testing of BGA and other CSP packages using probing techniquesST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Sep 14, 2004·8 cites·28 claims
- 0558US6404212B1Testing of BGA and other CSP packages using probing techniquesST ASSEMBLY TEST SERVICES PTE·Filed 1999·Granted Jun 11, 2002·17 cites·14 claims
- 0658US6300781B1Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing systemST ASSEMBLY TEST SERVICES PTE·Filed 1998·Granted Oct 9, 2001·23 cites·9 claims
- 0736US7076861B2Multi-package conversion kit for a pick and place handlerST ASSEMBLY TEST SERVICES PTE·Filed 2003·Granted Jul 18, 2006·1 cites·15 claims
- 0828US6433564B1BGA device positioner kitST ASSEMBY TEST SERVICES PTE L·Filed 1999·Granted Aug 13, 2002·6 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →