Inventor · disambiguated record
Loyde M. Carpenter, Jr.
Also filed as: CARPENTER JR LOYDE M · CARPENTER JR LOYDE MILTON
14 granted patents·1 pending application·9 citations·filing 2010–2019
86Inventor score
Top patents by PatentIndex Score
15 records- 0178US8871572B2Lead frame having a perimeter recess within periphery of component terminalIntersil Americas LLC·Filed 2012·Granted Oct 28, 2014·4 cites·12 claims
- 0277US9012267B2Method of manufacturing a packaged circuit including a lead frame and a laminate substrateIntersil Americas LLC·Filed 2013·Granted Apr 21, 2015·3 cites·4 claims
- 0363US8969137B2Solder flow-impeding plug on a lead frameIntersil Americas LLC·Filed 2012·Granted Mar 3, 2015·1 cites·16 claims
- 0462US8877564B2Solder flow impeding feature on a lead frameIntersil Americas LLC·Filed 2012·Granted Nov 4, 2014·1 cites·16 claims
- 0557US11150710B2Apparatuses and methods for encapsulated devicesIntersil Americas LLC·Filed 2019·Granted Oct 19, 2021·0 cites·20 claims
- 0654US9536852B2Lead frame having a perimeter recess within periphery of component terminalIntersil Americas LLC·Filed 2014·Granted Jan 3, 2017·0 cites·8 claims
- 0753US10582617B2Method of fabricating a circuit moduleIntersil Americas LLC·Filed 2017·Granted Mar 3, 2020·0 cites·15 claims
- 0852US9627297B2Solder flow-impeding plug on a lead frameIntersil Americas LLC·Filed 2015·Granted Apr 18, 2017·0 cites·9 claims
- 0952US9018746B2Solder flow impeding feature on a lead frameIntersil Americas LLC·Filed 2014·Granted Apr 28, 2015·0 cites·15 claims
- 1051US9717146B2Circuit module such as a high-density lead frame array (HDA) power module, and method of making sameYIN JIAN·Filed 2012·Granted Jul 25, 2017·0 cites·12 claims
- 1151US9613889B2Packaged circuit with a lead frame and laminate substrateIntersil Americas LLC·Filed 2015·Granted Apr 4, 2017·0 cites·16 claims
- 1250US10317965B2Apparatuses and methods for encapsulated devicesIntersil Americas LLC·Filed 2016·Granted Jun 11, 2019·0 cites·16 claims
- 1350US9177896B2Solder flow-impeding plug on a lead frameIntersil Americas LLC·Filed 2015·Granted Nov 3, 2015·0 cites·9 claims
- 1450US2017162488A1Packaged circuit with a lead frame and laminate substrateIntersil Americas LLC·Filed 2017·Application pending·0 cites
- 1534US8206836B2Tie-bar configuration for leadframe type carrier stripsCARPENTER JR LOYDE M·Filed 2010·Granted Jun 26, 2012·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →