Packaged circuit with a lead frame and laminate substrate

Abstract

Embodiments of the subject application provide for a circuit comprising: a lead frame having a first plurality of exposed terminals, the lead frame defining a plane; a laminate substrate in the plane defined by the lead frame, adjacent to the lead frame, and electrically coupled to the lead frame, the laminate substrate having a first surface including a second plurality of exposed terminals and a second surface opposite the first surface; a first one or more dies mounted on the lead frame and electrically coupled to the lead frame; and a second one or more dies mounted on the second surface of the laminate substrate and electrically coupled to the laminate substrate.

What is claimed is: 
     
         1 . A circuit comprising:
 a lead frame having a plurality of sections of conductive material, including at least one floating section that does not abut against an edge of the lead frame, the lead frame having a first surface including one or more pads and a second surface including a plurality of external terminals, wherein at least one of the external terminals is disposed on the at least one floating section;   a first one or more dies mounted to the first surface of the lead frame;   a laminate substrate mounted to the first surface, the laminate substrate having a third surface and a fourth surface, the third surface attached to the first surface of the lead frame, wherein the laminate substrate is coupled to the floating section; and   a second one or more dies mounted to the fourth surface of the laminate substrate.   
     
     
         2 . The circuit of  claim 1 , wherein the laminate substrate is composed of at least two layers of conductive material having at least one dielectric layer between the at least two layers, wherein a first layer of conductive material forms the third surface of the laminate substrate and a second layer of conductive material forms the fourth surface of the laminate substrate. 
     
     
         3 . The circuit of  claim 1 , wherein the plurality of external terminals comprise one of leads that extend outward from the second surface of the lead frame or pads on the second surface of the lead frame. 
     
     
         4 . The circuit of  claim 1 , wherein the third surface of the laminate substrate is attached to the floating section.