Inventor · disambiguated record
Louis L. Hsu
Also filed as: FLAKER LEGAL REPRESENTATIVE SH · HSU LOUIS · HSU LOUIS L · HSU LOUIS L C
471 granted patents·31 pending applications·16,720 citations·filing 1987–2014
99Inventor score
Top patents by PatentIndex Score
502 records- 0199US6556477B2Integrated chip having SRAM, DRAM and flash memory and method for fabricating the sameIBM·Filed 2001·Granted Apr 29, 2003·232 cites·13 claims
- 0299US6424011B1Mixed memory integration with NVRAM, dram and sram cell structures on same substrateIBM·Filed 1999·Granted Jul 23, 2002·322 cites·9 claims
- 0399US5528062AHigh-density DRAM structure on soiIBM·Filed 1992·Granted Jun 18, 1996·307 cites·20 claims
- 0499US5466625AMethod of making a high-density DRAM structure on SOIIBM·Filed 1994·Granted Nov 14, 1995·240 cites·3 claims
- 0599US5391510AFormation of self-aligned metal gate FETs using a benignant removable gate material during high temperature stepsIBM·Filed 1994·Granted Feb 21, 1995·394 cites·3 claims
- 0698US7560784B2Fin PIN diodeIBM·Filed 2007·Granted Jul 14, 2009·78 cites·21 claims
- 0798US7369410B2Apparatuses for dissipating heat from semiconductor devicesIBM·Filed 2006·Granted May 6, 2008·101 cites·4 claims
- 0898US7170164B2Cooling system for a semiconductor device and method of fabricating sameIBM·Filed 2005·Granted Jan 30, 2007·91 cites·17 claims
- 0998US6632741B1Self-trimming method on looped patternsIBM·Filed 2000·Granted Oct 14, 2003·341 cites·29 claims
- 1098US6552398B2T-Ram array having a planar cell structure and method for fabricating the sameIBM·Filed 2001·Granted Apr 22, 2003·218 cites·16 claims
- 1198US6549450B1Method and system for improving the performance on SOI memory arrays in an SRAM architecture systemIBM·Filed 2000·Granted Apr 15, 2003·226 cites·18 claims
- 1298US6420216B1Fuse processing using dielectric planarization pillarsIBM·Filed 2000·Granted Jul 16, 2002·331 cites·16 claims
- 1398US6232173B1Process for forming a memory structure that includes NVRAM, DRAM, and/or SRAM memory structures on one substrate and process for forming a new NVRAM cell structureIBM·Filed 1998·Granted May 15, 2001·230 cites·14 claims
- 1498US5784311ATwo-device memory cell on SOI for merged logic and memory applicationsIBM·Filed 1997·Granted Jul 21, 1998·278 cites·10 claims
- 1598US5585673ARefractory metal capped low resistivity metal conductor lines and viasIBM·Filed 1994·Granted Dec 17, 1996·174 cites·9 claims
- 1698US5300813ARefractory metal capped low resistivity metal conductor lines and viasIBM·Filed 1992·Granted Apr 5, 1994·155 cites·9 claims
- 1797US7531407B2Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating sameIBM·Filed 2006·Granted May 12, 2009·61 cites·11 claims
- 1897US7489025B2Device and method for fabricating double-sided SOI wafer scale package with optical through via connectionsIBM·Filed 2006·Granted Feb 10, 2009·36 cites·22 claims
- 1997US6670234B2Method of integrating volatile and non-volatile memory cells on the same substrate and a semiconductor memory device thereofIBM·Filed 2001·Granted Dec 30, 2003·115 cites·19 claims
- 2097US5880991AStructure for low cost mixed memory integration, new NVRAM structure, and process for forming the mixed memory and NVRAM structureIBM·Filed 1997·Granted Mar 9, 1999·158 cites·9 claims
- 2197US5811857ASilicon-on-insulator body-coupled gated diode for electrostatic discharge (ESD) and analog applicationsIBM·Filed 1996·Granted Sep 22, 1998·167 cites·29 claims
- 2297US5774411AMethods to enhance SOI SRAM cell stabilityIBM·Filed 1996·Granted Jun 30, 1998·206 cites·20 claims
- 2396US7863960B2Three-dimensional chip-stack synchronizationIBM·Filed 2009·Granted Jan 4, 2011·38 cites·26 claims
- 2496US7514271B2Method of forming high density planar magnetic domain wall memoryIBM·Filed 2007·Granted Apr 7, 2009·36 cites·10 claims
- 2596US7394273B2On-chip electromigration monitoring systemIBM·Filed 2006·Granted Jul 1, 2008·31 cites·7 claims
- 2696US7384838B2Semiconductor FinFET structures with encapsulated gate electrodes and methods for forming such semiconductor FinFET structuresIBM·Filed 2005·Granted Jun 10, 2008·39 cites·14 claims
- 2796US7283410B2Real-time adaptive SRAM array for high SEU immunityIBM·Filed 2006·Granted Oct 16, 2007·52 cites·20 claims
- 2896US7029951B2Cooling system for a semiconductor device and method of fabricating sameIBM·Filed 2003·Granted Apr 18, 2006·97 cites·35 claims
- 2996US6825534B2Semiconductor device on a combination bulk silicon and silicon-on-insulator (SOI) substrateIBM·Filed 2000·Granted Nov 30, 2004·113 cites·28 claims
- 3096US6541815B1High-density dual-cell flash memory structureIBM·Filed 2001·Granted Apr 1, 2003·117 cites·14 claims
- 3196US6531911B1Low-power band-gap reference and temperature sensor circuitIBM·Filed 2000·Granted Mar 11, 2003·103 cites·24 claims
- 3296US6245613B1Field effect transistor having a floating gateIBM·Filed 2000·Granted Jun 12, 2001·190 cites·6 claims
- 3396US5403779ARefractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVDIBM·Filed 1992·Granted Apr 4, 1995·103 cites·37 claims
- 3495US7984408B2Structures incorporating semiconductor device structures with reduced junction capacitance and drain induced barrier loweringIBM·Filed 2007·Granted Jul 19, 2011·36 cites·8 claims
- 3595US7893529B2Thermoelectric 3D coolingIBM·Filed 2009·Granted Feb 22, 2011·34 cites·12 claims
- 3695US7312529B2Structure and method for producing multiple size interconnectionsIBM·Filed 2005·Granted Dec 25, 2007·36 cites·18 claims
- 3795US6876250B2Low-power band-gap reference and temperature sensor circuitIBM·Filed 2003·Granted Apr 5, 2005·94 cites·30 claims
- 3895US6411157B1Self-refresh on-chip voltage generatorIBM·Filed 2000·Granted Jun 25, 2002·99 cites·29 claims
- 3995US6337513B1Chip packaging system and method using deposited diamond filmIBM·Filed 1999·Granted Jan 8, 2002·188 cites·17 claims
- 4095US6097056AField effect transistor having a floating gateIBM·Filed 1998·Granted Aug 1, 2000·166 cites·8 claims
- 4195US5405795AMethod of forming a SOI transistor having a self-aligned body contactIBM·Filed 1994·Granted Apr 11, 1995·110 cites·10 claims
- 4294US7098070B2Device and method for fabricating double-sided SOI wafer scale package with through via connectionsIBM·Filed 2004·Granted Aug 29, 2006·63 cites·29 claims
- 4394US6611033B2Micromachined electromechanical (MEM) random access memory array and method of making sameIBM·Filed 2001·Granted Aug 26, 2003·90 cites·22 claims
- 4494US6437623B1Data retention registersIBM·Filed 2001·Granted Aug 20, 2002·64 cites·18 claims
- 4594US6352882B1Silicon-on-insulator structure for electrostatic discharge protection and improved heat dissipationIBM·Filed 2000·Granted Mar 5, 2002·80 cites·11 claims
- 4694US6323554B1Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVDIBM·Filed 1998·Granted Nov 27, 2001·117 cites·18 claims
- 4794US6144054ADRAM cell having an annular signal transfer regionIBM·Filed 1998·Granted Nov 7, 2000·106 cites·13 claims
- 4894US5532089ASimplified fabrication methods for rim phase-shift masksIBM·Filed 1993·Granted Jul 2, 1996·105 cites·16 claims
- 4994US5234535AMethod of producing a thin silicon-on-insulator layerIBM·Filed 1992·Granted Aug 10, 1993·197 cites·24 claims
- 5093US8211756B23D chip-stack with fuse-type through silicon viaFENG KAI DI·Filed 2010·Granted Jul 3, 2012·15 cites·11 claims
Showing the top 50 of 502 patent records by PatentIndex Score.
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